I guess this implies domestic DUVi is ready for mass deployment?
people are telling FT that several advanced node production lines are coming online over the next year. That’s the most important note I saw from this.
I guess this implies domestic DUVi is ready for mass deployment?
people are telling FT that several advanced node production lines are coming online over the next year. That’s the most important note I saw from this.
YMTC announcing fully domestic NAND lines recently had implied that already. NAND uses DUVi.I guess this implies domestic DUVi is ready for mass deployment?
that + rest of the supply chain.I guess this implies domestic DUVi is ready for mass deployment?
I told him years ago metrology was not a real technical bottleneck. He scoffed *shrug*that + rest of the supply chain.
Remember, hvpc said SiGe epi was a constraining factor. That never made anything to me. Then, there was the stuff about metrology tools not being good enough to replace KLA. I guess they are good enough now.
If they can get to 100k wpm of 5-7nm by end of 2026, that'd be crazy amount of HPC revenue + phone revenues.
Sorry but would you mind elaborating why metrology was not a real bottleneck?I told him years ago metrology was not a real technical bottleneck. He scoffed *shrug*
Because people confuse China being technically incapable of doing something with China not bothering to commercialize something. If China had free and secure access to tools from the likes of KLA or Applied Materials, there'd be no reason to go through the expense and time of developing them indigenously. To Beltway types this translates to China not being able to make these tools. Once the impetus to develop them materialized through the export controls, Chinese companies like Naura and CETC entered the space and developed analogues in a few years.Sorry but would you mind elaborating why metrology was not a real bottleneck?
For a monopoly is deeply worrisome to see multiple companies, no huge companies by the way, manufacturing the same equipment that they do when they are not allow to sells theirs.Sorry but would you mind elaborating why metrology was not a real bottleneck?
The SoC is complete, which Apple has not yet mastered. From this point on, feature size is the only road block.
Tech war: Huawei reveals Kirin chip inside 5G smartphones as firm overcomes US sanctions
The name of Huawei’s chipset, which was designed by semiconductor design subsidiary HiSilicon, was found prominently displayed in screenshots shared online by Pura 80 users after a system update of the handset.
Information about the processors used by Huawei on 5G smartphones, including the Mate 60 Pro and Mate 70 series, was previously uncovered only via third-party teardown analyses, without any official confirmation from the Shenzhen-based company.