Chinese semiconductor thread II

Oldschool

Junior Member
Registered Member
It's quite possible he has insiders contact in China. But we should not confuse the people who work in the industry with the people making the breakthroughs to catch up with ASML. The latter is a subset of the former. I've always believed that many Chinese companies are ran by dinosaurs and should not be assumed to be competent simply because they are Chinese. It takes real talent, drive, and ambition to disrupt an industry, and the reality is, most people don't have it in them. Thus the need to focus on those who few who do.
I doubt he has any contact.
If he has he wouldn't have said DUV immersion is a pipe dream
Sounds like he is smoking too much weeds living in denial and fantasy in his chip war campaign.
 

sunnymaxi

Major
Registered Member
It's quite possible he has insiders contact in China
many people have contacts.. so pleaseeeeeeeeeeeeeeee :):)

The latter is a subset of the former. I've always believed that many Chinese companies are ran by dinosaurs and should not be assumed to be competent simply because they are Chinese. It takes real talent, drive, and ambition to disrupt an industry, and the reality is, most people don't have it in them. Thus the need to focus on those who few who do.
this statement would have been 100 percent accurate in 2020 year but its now completely outdated.

you said, ''I've always believed that many Chinese companies are ran by dinosaurs and should not be assumed to be competent simply because they are Chinese''

NAURA - become 6th largest SME manufacturer in 2024.. Revenue Up 40%

AMEC - become 10th largest SME manufacturer in 2024.. Revenue Up 45%

ACM - about to enter in top 10 SME manufacturer this year.. Revenue Up 51%

PioTech - about to become $1 billion worth Semi equipment manufacturer.. Revenue Up 80%

Jingce Semi - within two years they will enter in $1 billion club.. Revenue Up 80%

Kingsemi- Revenue Up 24% , Jingsheng Electro - Revenue Up 30% , Hwatsing - Revenue Up 33% , Jiaxin Semiconductor - Revenue Up 110%

SiCarrier - they literally released entire line-up of semiconductor tools from 28nm to 5nm. Revenue Up seven folds in last 5 years.

YMTC achieved 294 layer nand flash with domestic tools, they have been blacklisted since 2022

CXMT working with domestic tools for 16nm DRAM.

BOE/TCL/smartsense/Omnivision and many more IC related companies have record revenue with domestic tools/equipment.

its astonishing to see, almost entire Chinese semi supply chain thriving with record revenue in 2024.. from material to design to tools and fabrication.
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where were all these companies in 2019 , 2020 ???? nobody knew their names. all were struggling or begging for customers but rejected by even local Chinese fabs. but what suddenly happened in just 4-5 years ?? it is because of USA sanctions. even a random Chinese semi company is now thriving getting repeat orders and gaining customer base. all those companies which were run by ''DinOsAuRs'' got hit very hard and they sorted out shit together and look at the results.
 
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latenlazy

Brigadier
View attachment 148995

The invention addresses the need for a droplet generation system capable of precisely applying ultrasonic energy to metal droplets, improving energy conversion efficiency while enabling control over droplet size, spacing, frequency, and speed. It also provides an Extreme Ultraviolet (EUV) light generation device incorporating this system.

Key Components of the Droplet Generation System:
  1. Focused Ultrasonic Device: Positioned above the droplet generator, it emits focused ultrasonic waves to perturb droplets. This ensures uniformity ("monodisperse") and precise control over droplet characteristics.
    • Subcomponents of the Focused Ultrasonic Device:
      • Signal Generator: Produces ultrasonic waves of a specified waveform.
      • Power Amplifier: Adjusts the intensity of the ultrasonic signal.
      • Focused Ultrasonic Transducer: Uses a spherical cap piezoelectric ceramic to focus and transmit ultrasound.
      • Conical Rod: Conducts focused ultrasound toward droplets. Its adjustable small end allows fine-tuning the focal point. A coupling agent (e.g., gel) ensures efficient energy transfer between the transducer and the rod.
      • Arc-Shaped Fixed Cover: Secures the transducer and part of the conical rod, ensuring structural stability.
  2. Technical Specifications:
    • Diameter (D): 1 mm ≤ D ≤ 200 mm.
    • Frequency (F): 20 kHz ≤ F ≤ 20 MHz.
    • Focusing Methods: Includes unit lens, multi-element facet, single annular self-focusing, or phased array ultrasound.
Advantages:
  • Energy Efficiency: Enhances ultrasound transmission efficiency, reduces power consumption, and lowers operational costs.
  • Precision Control: Enables bidirectional (vertical/radial) droplet perturbation and improves spatial accuracy of ultrasound-driven droplet manipulation.
  • Cost-Effectiveness: Utilizes standard components, avoiding high-cost specialized structures.
  • Scalability: Adjustable parameters (e.g., conical rod position, frequency) allow adaptability to different applications.
You’d all be surprised by how not special this technology is XD
 

OppositeDay

Senior Member
Registered Member
Huawei Pura X is equipped with a new Kirin CPU and integrates memory for the first time! Even Qualcomm can't do it

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I wouldn't say Qualcomm couldn't do it. Qualcomm is not a phone maker themselves and supply chain flexibility from allowing customers to source their dram could be an advantage. Anti-monopoly issues could a concern too. US wouldn't like Qualcomm to package Chinese dram and Chinese regulators wouldn't look upon Qualcomm kindly if it exclude Chinese memory makers.
 
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ansy1968

Brigadier
Registered Member
From SCMP

A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world's largest N-polar gallium nitride (GaN) wafer, at eight inches (20.3cm).8 hours ago

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From Data Center Dynamics


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Sep 12, 2024 — Infineon successfully manufactures 300mm power gallium nitride wafers. Larger wafers more advanced and efficient than 200mm counterparts.

So which one is true?
 
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