keep in mind of the power requirements of 6th gen.
F-35 right now is having a hard time because they are trying to future proof the demand by increasing thermal management to 80kw.
The major consumption of power on an aircraft is the radar.
Here is APG-79 for super hornet
View attachment 140871
This uses GaA T/R modules and it already requires 15kW of power requirement so liquid cooling needs to be 15.6kW. Since APG-81 is from the same generation and uses GaA T/R modules also, it's probably at this mark or a little more just for the radar. I would assume there is some more consumption from computers and processors, communication gears, powering of EW pods, EODAS and such, but the maximum usage is the radar. One could see how they got to the current requirement of 30kW max of cooling and want to increase it to 80kW
1600 T/R module at 16kW would be 10 watt per T/R module, that I would imagine is the maximum possible for GaA modules from back in 2000s.
But nowadays, we are using GaN-on-Si, which should be at least several times that of GaA. In the future, we need to get ready for GaN on Diamond (or GaN-on-Sic if you are less ambitious)
Just a cursory glance on google search, you will find a GaN T/R module can have peak 100W power.
If you plaster 3000 T/R module. That would be capable of using 300kW of power.
View attachment 140872
Another look here, you can see the thermal conductivity of GaA is just 0.46 vs 1.3 on GaN vs 22 for diamond.
melting point is also much lower in GaA vs GaN vs Diamond.
There is a reason why GaA is only used for mobile phone power amplifiers now. The 5G cell towers all use GaN.
Remember from this
Guobo has capacity for at least 20 million GaN chips and packaging for cell tower. You need more power on your cell tower, so you have to use a material that's capable of handling more power. That would be GaN, not GaA
Notice SiC's thermal conductivity is 3.5 and Si is 1.5? That's why GaN-on-SiC has better performance than GaN-On-Si
Macom was awarded money by DoD from CHIPS act for GaN-on-Sic.
So, if GaN-on-Si is at 8x GaA and GaN-on-Sic is 2x of Si and GaN-on-Diamond is 3x of Si.
Then, it would reason that 3000 T/R module GaN-on-Diamond may emit something close to 1MW in power.
I think all the computation power is probably going to be at most 10% of that. Even 8 Ascend-910B GPUs + 16 CPUs @ 300W each would be at most 7.5kW. Not in the same ball park.
Thermal management system needs to be able to handle 1MW in cooling requirement if you want to use the most powerful ever radar. Which is GaN-on-Diamond.
So peak power consumption requirement might be higher than 1MW!
so how much thrust is needed to support that much power generation?
Now, let's say you have nice battery and electric generator technology that is highly efficient and can shave peaks of your demand and that you only need to sustain 800kW power
LM-2500+ at 5.25t can generate 35MW of power
A modern large turbofan of 1.7t (around WS-10C/WS-15 weight?) should be able to generate 10-15MW of power if that's all it did. As such, it doesn't really need to divert that much of its thrust to power the electrical stuff.
So, the key is still to have enough space for the plumbing needed to cool all that power generation from RF coming out of the aircraft.