Chinese semiconductor thread II

tokenanalyst

Lieutenant General
Registered Member

Sugon unveils a new generation of general-purpose high-performance computing platform, achieving AVX-512 instruction set compatibility for the first time in China.​


Sugon has officially launched its new generation of general-purpose high-performance computing (HPC) platform, marking a significant breakthrough in the domestic computing ecosystem. A major highlight of this release is that it is the first domestically developed general-purpose computing platform to natively support the AVX-512 instruction set while being fully adapted to the x86 software ecosystem. Because AVX-512 is the mainstream global standard for HPC, this native compatibility allows existing professional software in fields like meteorological simulation, materials calculation, and biomedical research to run directly without code modification or recompilation. This drastically reduces migration time and transformation costs for institutions transitioning to domestic computing power.

In terms of hardware performance, the platform is powered by a domestically produced 128-core general-purpose CPU capable of delivering 10 TFLOPS of FP64 double-precision computing power per processor. Official tests indicate that compared to its predecessor, the platform nearly doubles its HPL double-precision floating-point and STREAM memory access performance, while overall scientific and industrial simulation applications see an average improvement of 80% to 100%, matching the specifications of leading international flagship products. To support massive parallel computing clusters with tens of thousands of cards, the system employs a full-stack collaborative optimization solution. This includes BurstBuffer caching, SocketDirect communication, ParaStor F9000 all-flash distributed storage, and a self-developed scaleFabric high-speed interconnect switch, achieving an ultra-low end-to-end communication latency of just 0.93 microseconds.

To accommodate diverse data center requirements, Sugon has introduced three standardized computing node architectures featuring different cooling technologies. The lineup features standard 2U air-cooled servers for small to medium research clusters, alongside high-density cold-plate liquid-cooled cabinets that lower Power Usage Effectiveness (PUE) to 1.08 for medium industrial centers. For ultra-high-density national supercomputing hubs, the platform offers third-generation immersion phase-change liquid-cooled cabinets with a PUE as low as 1.04. Designed for high-precision general-purpose computing, the platform targets critical sectors such as geophysical exploration, industrial design simulation, integrated circuit R&D, life sciences, and weather forecasting. With complete delivery capabilities ranging from single nodes to large-scale clusters, the platform is currently available for deployment by domestic research institutes, manufacturing enterprises, and local computing platforms.​
.
Please, Log in or Register to view URLs content!
 

tokenanalyst

Lieutenant General
Registered Member

FugaGa has become the first company in the world to launch and mass-produce (011)-plane 2-inch gallium oxide substrates.​

Hangzhou Fuga Gallium Industry Technology Co., Ltd. (hereinafter referred to as "Fuga Gallium") announced that it has achieved stable mass production capacity for (011)-faceted gallium oxide (Ga₂O₃) single crystal substrates, and can continuously deliver to domestic and foreign research institutions and enterprises. This progress marks an important breakthrough for Fuga Gallium in the commercialization layout of multi-faceted and multi-specification gallium oxide substrates, and further improves the company's product matrix.

Recently, the Shenzhen Pinghu Laboratory conducted high-resolution X-ray diffraction (HRXRD) tests on the 2-inch gallium oxide (Ga₂O₃) single crystal substrate of Fuga Gallium Industry (011). The results showed that the average full width at half maximum (FWHM) of the wafer at 5 points was approximately 16.2 arcsec.

A smaller FWHM value indicates a lower dislocation density and higher lattice integrity in the crystal. This test employed a triaxial mode, which offers higher angular resolution compared to biaxial testing, allowing the results to more accurately reflect the intrinsic quality of the crystal. This fully demonstrates that the (011)-plane gallium oxide (Ga₂O₃) single-crystal substrates mass-produced by FugaGa have reached internationally advanced quality levels, providing highly reliable material support for downstream applications such as power devices and deep ultraviolet detectors.

1781621752352.png

Please, Log in or Register to view URLs content!
 

tokenanalyst

Lieutenant General
Registered Member

Generation and characterization of Ho: YLF solid-state laser-driven tin plasma for EUV lithography​


Solid-state lasers operating at near- or mid-infrared wavelengths have great potential to become the future drive source of laser-produced plasma (LPP) light source for extreme ultraviolet (EUV) lithography. Here, we demonstrate the first comprehensive multi-diagnostic characterization and efficient 13.5-nm in-band EUV generation from a tin plasma driven by a self-developed 2 μm Ho: YLF solid-state laser. Furthermore, we systematically compare the plasma and EUV radiation for 1 μm and 2 μm driving lasers, showing enhanced EUV emissivity and reduced optical depth as well as markedly more isotropic angular distributions for the 2 μm case. It is worth noting that the EUV wall-plug conversion efficiency, defined as the electrical-to-EUV efficiency, reaches approximately 3‰ for the single-pulse 2 μm driver demonstrated in this work. This value is about 1.5 times higher than the approximately 2‰ estimated for commercial multi-pulse CO2-driven LPP-EUV lithography sources. These results establish Ho-doped 2 μm solid-state lasers as a promising driver for LPP-EUV sources. Moreover, this work provides a quantitative framework for further optimizing optical depth and laser-to-EUV conversion efficiency, with great potential for the next generation of EUV lithography.​

1781656685891.png

Please, Log in or Register to view URLs content!
 

tokenanalyst

Lieutenant General
Registered Member

O-Film establishes a specialized machine vision company to deepen its strategic layout in the machine vision field.​

Recently, O-Film Machine Vision Technology (Jiangxi) Co., Ltd. (hereinafter referred to as "O-Film Machine Vision") was officially established in Nanchang. As a new strategic platform for O-Film Group to deeply cultivate the field of machine vision, O-Film Machine Vision will rely on the industrial cluster advantages of Jiangxi and O-Film's accumulated optical and optoelectronic technologies to focus on core areas such as 3D visual perception and industrial intelligent inspection, providing full-stack machine vision solutions for domestic intelligent manufacturing, intelligent vehicles, robotics, and other sectors. The independent establishment of this specialized machine vision company is an important measure for O-Film to vertically implement its years of technological accumulation, and it will strive to create a new high ground for the domestic machine vision industry.

Leveraging the group's deep technological expertise in the field of optics, O-Film's core product advantages in machine vision have been validated in multiple scenarios. In the field of LiDAR, O-Film's industry-first true 2D addressing short-range solid-state LiDAR boasts a highly integrated pure solid-state architecture, chip-level design and manufacturing, coverage of different viewing angles and application distances, centimeter-level precision sensing, and strong scene adaptability. It also features low power consumption, solves problems such as high anti-expansion, and suppresses multipath and dust interference, providing a reliable spatial perception foundation for advanced autonomous driving and autonomous mobile systems.

664237715501.7794.jpg


For the robotics field, O-Film's RoboVision series debuts with the Dex400R camera, a compact design measuring only 45mm*28mm*28mm. It boasts a close-range recognition accuracy of <1.5mm at 10-20cm, achieving millimeter-level ultra-high perception precision. Supporting D2C+IMU synchronization, data acquisition, and external triggering modes, it enables hand-eye coordination, unordered grasping, and near- and far-field obstacle avoidance. Tailored for general robotic scenarios, its hardware-level synchronization, global shutter, and IMU fusion design ensure the stability and accuracy of high-speed dynamic robot operations.

Please, Log in or Register to view URLs content!
 

tokenanalyst

Lieutenant General
Registered Member

Huazhuo Precision Technology completes IPO preparation for listing on the Science and Technology Innovation Board.​


Beijing Huazhuo Precision Technology Co., Ltd. has completed its IPO counseling preparation for a second attempt to list on China’s STAR Market (Science and Technology Innovation Board). Sponsor China Merchants Securities confirmed the milestone on June 17, 2026. The company must submit formal application materials within 12 months of receiving regulatory approval, with an estimated 2–3 month prep period due to prior review inquiries.

Originally applying in June 2020 (passed committee review in Sept 2021) and voluntarily withdrawing in June 2024 for strategic reasons, Huazhuo Precision has since overhauled its corporate governance, accounting, and internal control systems. All intermediary institutions were replaced during this cycle, with China Merchants Securities taking over brokerage duties and Beijing Bangsheng Law Firm appointed as legal counsel.

Huazhuo Precision specializes in ultra-precision measurement and control technologies for semiconductor manufacturing. Key products include:​
  • Lithography components: precision motion systems, electrostatic chucks, vibration isolators​
1781710850317.png
  • Advanced packaging equipment: W2W wafer fusion bonding (delivered June 10, 2026), D2W hybrid bonding (delivered Feb 2026) The company has achieved domestic mass production of multiple IC-process electrostatic chucks and holds over 30 authorized patents in related fields.​
1781710797360.png
While China’s overall semiconductor equipment localization rate is projected at ~35%. In the domestic electrostatic chuck market, Huazhuo sits in Tier 2, alongside firms like Fuchuang Precision and Kema Technology, competing against international leaders (Applied Materials, Lam Research). Accelerating localization efforts are drawing more Chinese entrants into the space, intensifying competition but also creating significant substitution opportunities.​

Please, Log in or Register to view URLs content!
 

tokenanalyst

Lieutenant General
Registered Member

Jingzhan Semiconductor Achieves New Breakthrough in Micro LED Optical Communication Technology​


Crystal Semiconductor announced a new breakthrough in Micro LED optical communication technology. The company's 8-12 inch Si-based GaN Micro LED light source products have achieved benchmark-level measured results of 1.6 GHz bandwidth at a current density of 500 A/cm², and the power consumption of Micro LED light sources can be less than 1 pJ/bit.According to reports, Jingzhan Semiconductor started by optimizing the epitaxial materials. By designing and fabricating high-quality GaN-based multiple quantum well (MQW) epitaxial structures, it effectively suppressed the quantum confinement Stark effect (QCSE) and improved the carrier recombination rate. At the same time, it refined the structure of Micro LED devices, reduced the active area to reduce device capacitance and improve RC delay. In a collaboration between Jingzhan Semiconductor and Professor Shulong Lu's research group at the Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences , a -3dB cutoff frequency of 1.6 GHz was achieved under ultra-low current injection conditions of 500 A/cm², with device power consumption below 1 pJ/bit .
picture


Based on its independently developed 8-inch and 12-inch silicon-based GaN epitaxial technology, and combined with wafer-to-wafer (W2W) and chip-to-wafer (D2W) bonding processes, Jingzhan Semiconductor has achieved performance optimization of Micro LED optical communication devices. The related technologies are compatible with existing high-speed storage and communication system architectures, addressing the short-distance, high-speed interconnect application needs of data centers. With its low power consumption, low heat dissipation, and resistance to electromagnetic interference, Micro LED optical communication solutions are expected to become one of the future short-distance interconnect technology routes for data centers.Jingzhan Semiconductor was founded in 2012 and is headquartered in Suzhou Industrial Park. It is mainly engaged in the research and development and industrialization of gallium nitride (GaN-on-Si) epitaxial materials, and its products are used in fields such as power electronics and micro-displays.​

Please, Log in or Register to view URLs content!
 
Top