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Chinese semiconductor thread II
- Thread starter vincent
- Start date
Ignoring that fact that there is an entire supply chain for high end lithography machine components in China. He didn't mention RSLaser or any of the companies involve in China lithography supply chain. He thinks is only is SMEE. Typical stooge crap.
Wasted my time reading that garbage. This Pablo guy is absolutely clueless.
EMOptimizer®: The first fast electromagnetic simulation and optimization technology, leading a new era of RF passive chip design
EMOptimizer® has achieved unprecedented efficiency improvement in the field of RF integrated passive device design with its innovative fast electromagnetic simulation and optimization engine. Its unique algorithm architecture breaks the bottleneck of traditional electromagnetic simulation, which is time-consuming and inefficient, and enables designers to complete high-precision modeling and optimization iterations in a shorter time, significantly shortening the product development cycle.
The IP-based "reusability" concept has always been one of the core advantages of digital circuit design. It not only greatly improves design efficiency and flexibility, but also fundamentally accelerates the rapid evolution of global digital circuit technology.
In the process of RF design optimization, the "parametric" modeling method is a key tool to break through the very time-consuming traditional electromagnetic simulation iteration bottleneck, which can significantly improve the efficiency of design exploration and optimization.
Since 2017, Fadong Technology has taken the lead in creatively introducing the two core concepts of "reusability" and "parameterization" into the field of RF integrated passive chip design, starting a systematic study of this innovative design paradigm and achieving important patent breakthroughs. This technical achievement was granted national invention patents on December 7, 2021 (China), July 30, 2024 (China) and January 14, 2025 (USA), marking that Fadong Technology has pioneered and established the technical development route of "fast simulation" and "fast optimization" of integrated passive chips worldwide, effectively solving the design efficiency and accuracy problems that have long plagued the industry.
As the culmination of this innovative system, the commercial EDA software EMOptimizer® came into being. It is not only an important milestone in the above research results, but also a revolutionary reshaping of the analog/RF integrated circuit design process. By deeply integrating reusable mechanisms, parameterized models and high-performance optimization algorithms, EMOptimizer® has greatly improved the efficiency of the design closed loop and significantly reduced the risk of tape-out and development costs.
The IP-based "reusability" concept has always been one of the core advantages of digital circuit design. It not only greatly improves design efficiency and flexibility, but also fundamentally accelerates the rapid evolution of global digital circuit technology.
In the process of RF design optimization, the "parametric" modeling method is a key tool to break through the very time-consuming traditional electromagnetic simulation iteration bottleneck, which can significantly improve the efficiency of design exploration and optimization.
Since 2017, Fadong Technology has taken the lead in creatively introducing the two core concepts of "reusability" and "parameterization" into the field of RF integrated passive chip design, starting a systematic study of this innovative design paradigm and achieving important patent breakthroughs. This technical achievement was granted national invention patents on December 7, 2021 (China), July 30, 2024 (China) and January 14, 2025 (USA), marking that Fadong Technology has pioneered and established the technical development route of "fast simulation" and "fast optimization" of integrated passive chips worldwide, effectively solving the design efficiency and accuracy problems that have long plagued the industry.
As the culmination of this innovative system, the commercial EDA software EMOptimizer® came into being. It is not only an important milestone in the above research results, but also a revolutionary reshaping of the analog/RF integrated circuit design process. By deeply integrating reusable mechanisms, parameterized models and high-performance optimization algorithms, EMOptimizer® has greatly improved the efficiency of the design closed loop and significantly reduced the risk of tape-out and development costs.
Dafu Technology plans to invest RMB 100 million in Anhui Yunta, a radio frequency front-end chip company
Dafu Technology issued an announcement stating that the company plans to invest in Anhui Yunta Electronic Technology Co., Ltd. (hereinafter referred to as "Anhui Yunta") through cash capital increase and equity transfer. The company plans to invest a total of no more than 100 million yuan. After the transaction is completed, it plans to hold no more than 20% of the equity of Anhui Yunta.
It is reported that Anhui Yunta is a high-tech enterprise focusing on the research and development and sales of RF front-end chips and module products, with its headquarters located in Hefei High-tech Zone, Anhui Province. Anhui Yunta is committed to promoting the localization of RF front-ends, breaking the monopoly of international giants with independent innovation technologies, and providing high-performance domestic RF front-end solutions for emerging fields such as 5G/6G communications, the Internet of Things, and the Internet of Vehicles.
It is reported that Anhui Yunta is a high-tech enterprise focusing on the research and development and sales of RF front-end chips and module products, with its headquarters located in Hefei High-tech Zone, Anhui Province. Anhui Yunta is committed to promoting the localization of RF front-ends, breaking the monopoly of international giants with independent innovation technologies, and providing high-performance domestic RF front-end solutions for emerging fields such as 5G/6G communications, the Internet of Things, and the Internet of Vehicles.
EETimes should be blacklisted from being posted here IMO. Just propaganda now.
Jiangfeng Electronics plans to raise 1.948 billion yuan to increase investment in sputtering targets and electrostatic chucks and other projects
Jiangfeng Electronics issued an announcement stating that the company plans to raise 1.948 billion yuan through a private placement to be used for the industrialization project of electrostatic chucks for integrated circuit equipment with an annual output of 5,100 units, the industrialization project of ultra-high purity metal sputtering targets for ultra-large-scale integrated circuits with an annual output of 12,300 units.
Jiangfeng Electronics said that with the expansion of domestic wafer fab capacity and the increasing demand for equipment independence, the company's target material and precision components business continued to grow. This expansion will ease the capacity bottleneck and meet customer needs.
It is worth noting that Jiangfeng Electronics plans to build a semiconductor target production base in South Korea, focusing on serving international leading customers such as SK Hynix and Samsung. The company said that the implementation of the South Korean project will enhance localized supply capabilities, optimize the global production capacity layout, and deepen cooperation with overseas industrial chains to help obtain more international orders.
In addition to the materials business, Jiangfeng Electronics has actively deployed in the field of precision parts for semiconductor equipment in recent years. It currently has the mass production capacity of more than 40,000 parts, and its products cover PVD, CVD, etching machines, ion implanters and other equipment. The company said that this fundraising will accelerate the localization process of key parts and promote the independent control of the domestic semiconductor equipment supply chain.
Some interesting claims in this piece about SMIC. Not clear how authoritative they are.
AI chips: Monthly shipments in June were close to the total of the first five months, and will continue to increase in the second half of the year.
Equipment yield improvement: Production line debugging was completed in June, and the yield of advanced processes has gradually recovered. It is expected to be close to the level of early mature production lines in the third quarter.
AI chips: Monthly shipments in June were close to the total of the first five months, and will continue to increase in the second half of the year.
Equipment yield improvement: Production line debugging was completed in June, and the yield of advanced processes has gradually recovered. It is expected to be close to the level of early mature production lines in the third quarter.
TSMC confirmed that it will gradually withdraw from the gallium nitride (GaN)
The article is written in a somewhat obfuscated style, but the key points are:
1. TSMC will exit GaN field due to price pressure from Chinese suppliers.
2. Big US customer Navitas will switch to Taiwan Powerchip
3. Big Chinese customer BYD is not clear to where it will go. BYD went with TSMC instead of Chinese leader Innoscience because the latter is also an IDM (sell their own chips) so it is also in some way a competitor of BYD
The Digitimes article frames the exit of TSMC from GaN as a problem for China, but of course this is just cope. It is obvious Chinese GaN suppliers will greatly benefit from this decision by TSMC.
The article is written in a somewhat obfuscated style, but the key points are:
1. TSMC will exit GaN field due to price pressure from Chinese suppliers.
2. Big US customer Navitas will switch to Taiwan Powerchip
3. Big Chinese customer BYD is not clear to where it will go. BYD went with TSMC instead of Chinese leader Innoscience because the latter is also an IDM (sell their own chips) so it is also in some way a competitor of BYD
The Digitimes article frames the exit of TSMC from GaN as a problem for China, but of course this is just cope. It is obvious Chinese GaN suppliers will greatly benefit from this decision by TSMC.