Chinese semiconductor thread II

gelgoog

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RISC-V AIoT SoC SpaceMIT K1 has reached 100k in sales. Sales seem to be picking up at faster pace. It's seen great adoption in the past 6 month.

I personally have not tried this myself, but if you want to try it out, looks like Sipeed has a board for it.
The K1 is a good processor but SpaceMIT got a lot of flack for using the Alibaba T-Head open source chip design as a base for it without credit. They basically took T-Head's work and added Vector 1.0 support. K1 is the first market available RISC-V chip meeting the specification while being fairly cheap as well.

I am more interested in their higher end out of order core design which still does not seem to be available.
 
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tphuang

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CXMT allegedly plan to IPO?
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yes, they are going to IPO soon.

The K1 is a good processor but SpaceMIT got a lot of flack for using the Alibaba T-Head open source chip design as a base for it without credit. They basically took T-Head's work and added Vector 1.0 support. K1 is the first market available RISC-V chip meeting the specification while being fairly cheap as well.

I am more interested in their higher end out of order core design which still does not seem to be available.
interesting, I will see if I can get their board and test it out myself. very interesting
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This RISC-V OS they use based on ubuntu has support for ONNX, Ollama and llama.cpp on their platform.

If they can get their software up to par, then it could turn out to something. RISC-V is so under supported across all the open source libraries compared to ARM. So basically, you are limited on what you can try on these things

If they are serious about these measurement here

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then the prefill model token generation speed is pretty good. I cannot get this level even using NPU on RK3588 or Axera AX650 boards.
 

tphuang

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The performance of K1 is still kind of weak compared with ARM SoCs in that price range. But it's a start. It provides RISC-V developers with a working RVA22 compliant hardware platform.
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This is actually not bad price for a SBC. A little more than orange pi 5, but nothing crazy.

Maybe they are onto something here. RISC-V chips for AI application has its own advantages. if you put an ARM SoC inside an edge device (depending on what it is), cooling becomes a real issue if too much power is consumed. Also you got battery concerns.
 

tokenanalyst

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Sugon and StarMap signed a cooperation agreement to jointly promote the application of advanced computing in the space field​

Inspur released an announcement stating that the company and China Science Star Map Co., Ltd. (hereinafter referred to as "China Science Star Map") signed the "Cooperative Development Framework Agreement" on July 8, 2025 to jointly promote technological innovation, application implementation and industrial development of advanced computing in the space field.

It is reported that Sugon provides innovative, efficient and reliable IT products, solutions and services to users in China and around the world. It has profound technical accumulation and leading market share in high-end computing, storage, security, data centers and other fields. It gives full play to its advantages in high-end computing, deploys technology research and development in the fields of intelligent computing, cloud computing, big data, etc., and creates a computing industry ecosystem, providing solid and reliable support for scientific research and innovation, industry informatization construction, industrial transformation and upgrading, and digital economic development.

China Science and Technology Star Map is a leader in aerospace information technology innovation, an integrator of the commercial aerospace industry chain, and a promoter of the development of the low-altitude economic industry. Based on the digital earth, it deeply integrates new-generation information technologies such as artificial intelligence, big data, and cloud computing with commercial aerospace and low-altitude economy, and builds an aerospace information service system that integrates data, computing, and applications, making the leap to the entire commercial aerospace industry chain.

Inspur said that in order to better leverage their leading and complementary advantages in the computing power industry and aerospace information technology, the two parties plan to carry out in-depth technology development cooperation and industrial resource cooperation in the field of space computing, promote the digital economy to serve the real economy, and actively promote the construction of emerging computing scenario capabilities.

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tokenanalyst

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Beijing Yitong semiconductor equipment super unicorn landed on the Science and Technology Innovation Board​


Beijing Yitong Semiconductor Technology Co., Ltd. successfully completed its initial public offering (IPO) in the capital market, issuing 296 million ordinary shares in RMB to the public and successfully raising 2.497 billion yuan. These funds will be mainly used for the company's development and technology reserve funds, as well as the Yitong Semiconductor Integrated Circuit Equipment R&D and Manufacturing Service Center project and the Yitong Semiconductor High-end Integrated Circuit Equipment R&D project. The implementation of these projects aims to further consolidate and expand the company's market advantages in the integrated circuit manufacturing industry.

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According to the prospectus, Yitong Semiconductor is a semiconductor equipment company operating globally, mainly engaged in the research and development, production and sales of wafer processing equipment required in the integrated circuit manufacturing process. It has three core products: dry degumming equipment, rapid thermal processing equipment, and dry etching equipment, which together form the company's technical barriers.

The so-called dry degumming equipment refers to the precise removal of photoresist residues after the photolithography process to avoid chemical contamination affecting chip performance, which is directly related to chip yield. At present, dry degumming equipment is a major "weapon" of Yitong Semiconductor, and the company ranks at the forefront in the field of semiconductor degumming annealing equipment.

The prospectus shows that in 2023, Etan Semiconductor's market share of dry desizing equipment and rapid thermal processing equipment ranked second in the world.

From 2022 to 2024, Eitong Semiconductor achieved operating income of RMB 4.763 billion, RMB 3.931 billion and RMB 4.633 billion, respectively, and net profit attributable to shareholders of the parent company was RMB 383 million, RMB 310 million and RMB 540 million, respectively.​

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tokenanalyst

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Yanwei Semiconductor completed the first round of financing of several hundred million yuan, with a total financing amount of nearly 1 billion​


Recently, YM Semiconductor completed the first round of financing of several hundred million yuan in Series A, led by several leading industry investment institutions. Since its establishment in October 2022, YM Semiconductor has raised nearly 1 billion yuan in total, and several old shareholders have made additional investments in successive rounds, demonstrating long-term confidence. This round of funds will focus on the core technology iteration, capacity expansion and next-generation product development of high-end thin film deposition equipment such as ALD, further strengthening the domestic substitution capabilities of high-end equipment.

Metal ALD equipment: In November 2024, Yanwei delivered the first 300mm metal atomic layer deposition equipment, which has reached the international leading level in technology. It can effectively deal with the problem of increased resistivity caused by process advancement and line width reduction, and successfully fill the gap in the domestic metal atomic layer deposition field, solving this problem that has long plagued the development of the industry.

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PEALD equipment: Achieve "double delivery" in a single month in April 2025: Yanwei Auratus equipment was delivered to domestic leading logic chip companies and advanced packaging customers at the same time. It took 18 months to fully cover the three tracks of logic, storage, and advanced packaging, providing a complete solution for semiconductor chip manufacturing.

YUMEI Semiconductor focuses on the research and development of high-end ALD, PECVD and special epitaxial equipment, and produces products with independent intellectual property rights and international competitiveness, covering Thermal ALD, PEALD, SI EPI, SiC EPI, PECVD, etc. The core team is led by former senior experts from international leading equipment companies, and more than 60% of the R&D personnel have master's and doctoral degrees. The products are widely used in high-end integrated circuits, power devices, RF components and advanced packaging fields.

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