ZhongdaoOptoelectronics disclosed that the company's NanoPro-150 nanometer-level wafer inspection equipment has once again received a repeat order from a leading customer in the global silicon carbide (SiC) industry, and will be used for defect detection in the front-end process of the customer's 8-inch SiC wafers.
Compared with traditional 6-inch SiC wafers, 8-inch SiC has significant advantages in unit cost, production efficiency and yield control, and is the mainstream direction of the future power semiconductor industry.
The chairman of Zhongdao Optoelectronics said that the localization rate of the company's NanoPro-150 series equipment has reached more than 95%, which greatly reduces the equipment investment cost of customers while ensuring performance.
This order is the second additional order from the customer within half a year, following the bulk purchase at the beginning of this year. The order was obtained after three months of rigorous technical benchmarking, and NanoPro-150 fully met the core indicators such as detection efficiency, stability and data traceability.
Earlier in January, Zhongdao Optoelectronics stated that it plans to invest more R&D resources in the field of nano-level defect detection of SiC wafers, and further improve the quality and efficiency of SiC wafer manufacturing through the upgrade of high-precision multi-mode defect detection technology, system optimization of artificial intelligence (AI) defect recognition algorithms, and improvement of overall equipment performance.
Currently, the company is developing the next generation of inspection equipment, NanoPro-200 and NanoPro-300, which will have higher inspection accuracy and wider process coverage. Among them, the technical specifications of NanoPro-200 have reached 40 nanometers, and it has made significant breakthroughs in AI intelligence and automation. The third generation NanoPro-300 has also entered the critical period of research and development.
