Chinese semiconductor thread II

tokenanalyst

Brigadier
Registered Member

Decomposition of electron ionization mass spectra and calculation of electron ionization cross sections of SnxHy for extreme ultraviolet lithography.​

Abstract​

The contamination of collector mirrors by Sn debris is one of the key factors affecting the lifespan of manufacturing machines in extreme ultraviolet lithography (EUVL). Hydrogen has been used as an \textit{in situ} cleaning solution for Sn. The reaction of H radicals with Sn produces SnH$_4$, which can be pumped out of the vessel. Electron impact ionization (EII) mass spectrometry will be used to monitor the reaction products. However, the isotopic effect complicates the deconvolution of the EII mass spectrum. In this investigation a Monte Carlo method for deconvolution of the mass spectrum is proposed and successfully applied to SnH$_4$ and Sn$_2$H$_6$, taking into account the natural isotopic distribution of Sn. Additionally, the simplex method for function minimization, which employs the Nelder-Mead optimization algorithm, is utilized as a benchmark. Both methods show good agreement with the experimental measurements. Furthermore, the EII cross section of the Sn atom is calculated using the level-to-level distorted-wave (LLDW) method and the experimental cross sections can be accurately reproduced by scaling the distorted-wave cross sections. The cross sections of SnH, SnH$_2$, SnH$_3$, Sn$_2$H$_4$ and Sn$_2$H$_6$ are calculated based on the Binary-Encounter-Bethe (BEB) model, utilizing the adiabatic ionization potential (AIP) and vertical ionization potential (VIP). This investigation in mass spectrum deconvolution and ionization cross sections provides a foundation for studying quantum yields in \textit{in situ} tin cleaning.

Please, Log in or Register to view URLs content!
 

tokenanalyst

Brigadier
Registered Member

With a total investment of 1.38 billion yuan, the annual production capacity of electronic-grade sulfuric acid at Zhongjuxin Central China Base will reach 60,000 tons.

On February 27, the second phase of the Zhongjuxin Central China Base and the electronic grade sulfuric acid quality improvement and capacity expansion project started in Qianjiang City, Hubei Province. The project covers an area of 30 acres and will expand the electronic grade sulfuric acid production capacity of the Central China Base from 40,000 tons/year to 60,000 tons/year. The project is scheduled to be completed by the end of 2025 and put into production in March 2026.

85c5425bf443bde44f2d3f319bea226c.jpg

(Source: Hubei Industry and Information Technology)
According to Hubei Industry and Information Technology, the total investment of the Zhongjuxin Central China Base project is 1.38 billion yuan, and it is located in Qianjiang Microelectronics Materials Industrial Park. The project uses sulfuric acid, hydrochloric acid, hydrogen and other by-products produced by the surrounding Jianghan Salt Chemical Industrial Park as raw materials, and processes them into electronic-grade sulfuric acid, electronic-grade ammonia water, electronic-grade hydrofluoric acid, high-purity chlorine and other products for the manufacture of integrated circuits . After all are completed and put into production, the output value can reach 1.2 billion yuan. At present, the first phase of the 52,500-ton ultra-pure electronic chemicals project was officially put into production on February 18, 2023 .

At present, with the growth of strategic emerging semiconductor industries such as integrated circuits and flat panel displays, the market demand for electronic-grade sulfuric acid continues to rise, and the industry's quality requirements for electronic-grade sulfuric acid are becoming higher. The second phase of the ultra-pure electronic chemicals project and the electronic-grade sulfuric acid quality improvement and capacity expansion project will mainly achieve the expansion of the electronic-grade sulfuric acid production capacity of the Central China base from 40,000 tons/year to 60,000 tons/year, and further improve product quality to continuously ensure the leading edge of the product and meet future market demand.

It is reported that Qianjiang focuses on the recycling of Jianghan Salt Chemical Industry's by-products, and promotes the agglomeration and development of leading companies in the electrical materials industry such as Changfei Optical Fiber, New Silicon Technology, Zhongjuxin, Dinglong, Jingrui, and Beixu. It focuses on domestic substitution of electronic special gases, photoresists, polishing fluids, etching fluids and other materials, serves leading companies such as BOE and Huaxing Optoelectronics, and builds a supporting base for Wuhan's optoelectronic information industry.


Please, Log in or Register to view URLs content!
 

Hyper

Junior Member
Registered Member
Report: Samsung Abandons Pursuit of Baidu’s 2nm AI Chip Orders






Baidu and Samsung where working on a 2nm AI custom chip for Baidu....but eventually Trump rained on the party.

Without possibilities to acquire Chinese customers and with US customers all under TSMC, Samsung is evaluating exiting the foundry business altogether.

Capability of manufacturing advanced semiconductors is a very high strategic and geopolitical key factor: in the long term only US and China will retain this capability, and anyone else will be cut out. US will not make the mistake a second time of giving it away. TSMC is only a temporary reality....I'd would not bet on TSMC surviving as is today after 2030. In the best case for them they will have mostly moved to US...yes, the best case for them is not good for them!
Samsung has itself to blame. Their yields are really bad. And by that I mean really bad.
 

tokenanalyst

Brigadier
Registered Member

Seven major semiconductor industrial parks started, built and completed​


Foshan Semiconductor Technology Park project officially started: a billion-level industrial cluster set sail
According to the Foshan High-tech Zone, the Foshan Talent Innovation Lighthouse Industrial Park Investment Promotion Conference and the groundbreaking ceremony of the Foshan Semiconductor Technology Park were held in Shishan, Nanhai on March 7. It is reported that the project is jointly built by the Guangdong Zhongke Semiconductor Micro-Nano Manufacturing Technology Research Institute and Nanhai District. It is planned to cover an area of 59 acres and a total construction area of about 80,000 square meters. It focuses on the development of the entire industrial chain of semiconductor equipment, materials, devices, etc., and is expected to form a 20 billion-level integrated circuit industry cluster in the future.

Zhejiang Lishui Semiconductor Chip Industrial Park Phase II Project Completion Acceptance
According to the official news released by Lishui Economic and Technological Development Zone, the second phase of the semiconductor chip industrial park project in Lishui Economic and Technological Development Zone, Zhejiang Province, has recently passed the completion acceptance. The total investment of the project is about 494 million yuan, covering an area of about 180 mu, and the newly added construction area is about 230,000 square meters. The park focuses on the construction of 8-inch wafer production lines, compound semiconductor R&D centers and supporting factories, with a designed annual production capacity of 1.2 million pieces.

As an important part of Zhejiang Province's "10,000 mu and 100 billion" new industrial platform, the park's Phase II has introduced leading companies such as Zhongxin Wafer and Anjie Technology, focusing on the research, development and production of third-generation semiconductor materials silicon carbide and gallium nitride.

At present, the park has gathered 42 semiconductor companies including Jiangfeng Electronics, Fulide, Zhongxin Wafer, Wangrong, Broadchip, Jingrui Electronics, etc., with a total investment of over 70 billion yuan. The output value will reach 4.5 billion yuan in 2024 and is expected to exceed 8 billion yuan in 2025. The park has formed a full industrial chain ecosystem from chip materials, equipment manufacturing, design and development, production and manufacturing, packaging and testing to application.


Suining High-tech Zone Semiconductor Park: Total investment of 350 million yuan, to be completed and put into use in 2026
In March this year, the second phase of the semiconductor industrial park in Suining High-tech Zone was officially launched, with a planned total investment of 350 million yuan, and is expected to be completed and put into use in June 2026. The park is located in Suining High-tech Zone, with a planned area of 500 acres. It is reported that the industrial park focuses on the development of power semiconductors, smart sensors and semiconductor materials, and builds supporting public service facilities such as EDA design platforms and testing centers.

Liaoning Kazuo: Building a Northern Semiconductor Industry Cluster
According to Liaoning Daily, Kazuo County, Liaoning Province is accelerating the construction of an industrial cluster with new semiconductor materials as the core. It has currently gathered 10 key enterprises, covering key material fields such as high-purity gallium, gallium arsenide, and indium phosphide, forming a relatively complete industrial chain from semiconductor early materials and auxiliary materials, compound semiconductors to chips (substrates).

Among them, Chaoyang Tongmei Crystal Technology Co., Ltd., as the global leader in compound semiconductor materials, has gallium arsenide and germanium crystal production capacity that ranks among the top in the world; Jinmei Gallium Industry is a domestic high-purity gallium production base with a product purity of 7N level.

Through the "business-to-business" model, the park has attracted supporting enterprises such as Isotope Semiconductor and Kaimei Quartz to settle in, and plans to integrate the resources of Tongmei Crystal, Boyu Semiconductor and other companies to prepare for listing on the Science and Technology Innovation Board. The goal is to achieve a 10 billion yuan output value by 2025 and become an important semiconductor material production base in the north.

Tianjin Xiqing: Invest 800 million to build a semiconductor industry base
According to Tianjin News, the Microelectronics Industrial Zone of Tianjin Economic and Technological Development Zone has made new progress recently, and the semiconductor industry base with a total investment of about 800 million yuan has been accelerated. The park focuses on integrated circuits and electronic information industries, and has gathered world top 500 companies such as Samsung, Rohm, and NXP, forming three major industrial chains of mobile communications, LED light sources, and electronic imaging.
To strengthen the industrial ecology, Xiqing District established the "Integrated Circuit Innovation Center", integrated the resources of universities such as Hebei University of Technology, built public service platforms such as EDA design and trial production, and launched the "Four Ones" support policy to attract more than 20 companies such as Kehui Semiconductor and Jet Wing to settle down. In the future, the park will deepen the "Focus on Samsung" strategy, promote the integration of advanced manufacturing and modern service industries, and create a new highland for the semiconductor industry in Beijing, Tianjin and Hebei.

Shenyang Hunnan District: Northern Chip Valley is accelerating its rise, Xinyuan Micro's 10 billion-level project started
On March 2, the spring key projects in Hunnan District, Shenyang City were concentratedly started and resumed, and the Xinyuan Micro high-end wafer processing equipment industrialization base with a total investment of 1 billion yuan was officially started. The project is invested and constructed by Xinyuan Micro, a leading domestic photolithography process coating and developing equipment company, with a planned area of 85,000 square meters. A new R&D and production base will be built, focusing on breakthroughs in 12-inch and above wafer processing equipment technology. It is expected that after it goes into production, it will significantly increase the market share of domestic semiconductor equipment.
As the core carrier of the "Northern Chip Valley", Hunan District simultaneously promoted the implementation of projects such as the industrialization of Dijing Semiconductor Precision Components and the industrialization of Hengyunchang RF Power Supplies. In the first quarter, 27 projects in the semiconductor and integrated circuit fields were started or resumed, with an annual planned investment of over 5 billion yuan.


Yiwu, Zhejiang: Pan-semiconductor Industrial Park starts foundation pit construction, and the layout of the industrial chain is accelerated
On March 6, the bidding for the foundation pit project of Yiwu Pan-Semiconductor Industrial Park was launched, marking the entry of the park construction into the substantive stage.

The project is located in Futian Street, Yiwu Economic and Technological Development Zone, Yiwu City. It plans to build a comprehensive building and supporting facilities, focusing on introducing enterprises in the fields of semiconductor materials and smart sensors to create a characteristic semiconductor industry cluster in the Yangtze River Delta. At present, the park has reserved a number of core technology projects and plans to accelerate the transformation of scientific and technological achievements and industrial collaboration through the "fund + base" model.


Please, Log in or Register to view URLs content!
 

tokenanalyst

Brigadier
Registered Member

New Micro Semiconductor Announces Launch of 650V E-mode GaN Power Process Foundry Platform​

Shanghai Xinwei Semiconductor Co., Ltd. ("Xinwei Semiconductor") officially launched a 650V silicon-based gallium nitride enhancement mode (E-mode) power process foundry platform. With its excellent characteristics such as high-frequency operation efficiency, ultra-low gate charge and low on-resistance, this platform provides an excellent solution for the application of a new generation of high-speed and high-efficiency power devices.

Products manufactured based on this process platform can be widely used in consumer electronics, industrial automation, data centers, new energy vehicles and other fields, showing strong market potential. The process platform uses a P-cap layer gate and a tungsten plug/aluminum integrated circuit interconnection process based on chemical mechanical planarization to achieve precise control of GaN morphology and low surface states. Key reliability indicators such as HTRB/HTGB/DHTOL meet JEDEC standards, ensuring that the devices manufactured on this platform can operate stably and for a long time.

In addition, the performance of devices manufactured using this platform is extremely competitive: low specific on-resistance (Rsp) of approximately 350mΩ·mm², excellent quality factor (Ron·Qg) of ~300mΩ·nC, achieving a double breakthrough in low switching loss and conduction loss, bringing significant cost benefits and performance improvements to customers.​

Please, Log in or Register to view URLs content!
 

tokenanalyst

Brigadier
Registered Member

Performance Optimization of Sulfonium-Functionalized Molecular Resists for EUV and Electron Beam Lithography​


We report the synthesis and lithographic evaluation of a series of sulfonium-functionalized molecules nonchemically amplified resists (n-CARs) designed for high-resolution lithography. These molecular resists, built upon a rigid adamantane core, feature varied substitution positions (meta or para), side chains (methoxy or butoxy), and counteranions (CF3SO3–, BF4–, PF6–, and SbF6–). Our study highlights that meta-substitution and the incorporation of flexible butoxy side chains significantly enhance the film quality and lithographic performance. Notably, the ADMBu-TF resist, functionalized with CF3SO3– and meta-substituted butoxy chains, exhibits the best lithographic performance. Using extreme ultraviolet lithography, we achieved 15 nm line/space (L/S) patterns with a line-edge roughness of 2.2 nm, positioning this resist as a promising candidate for next-generation lithographic processes.

View attachment 147478

Please, Log in or Register to view URLs content!
Incredible how good this lines look compared to IMEC

China Academy of Science.
1741621394290.png


IMEC

1741621338291.png
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
Report: Samsung Abandons Pursuit of Baidu’s 2nm AI Chip Orders






Baidu and Samsung where working on a 2nm AI custom chip for Baidu....but eventually Trump rained on the party.

Without possibilities to acquire Chinese customers and with US customers all under TSMC, Samsung is evaluating exiting the foundry business altogether.

Capability of manufacturing advanced semiconductors is a very high strategic and geopolitical key factor: in the long term only US and China will retain this capability, and anyone else will be cut out. US will not make the mistake a second time of giving it away. TSMC is only a temporary reality....I'd would not bet on TSMC surviving as is today after 2030. In the best case for them they will have mostly moved to US...yes, the best case for them is not good for them!

keep in mind that Samsung still has a robust mature node chipmaking business using mostly depreciated equipment. So, while I do see Samsung being in trouble longer term in logic node, I don't see an exit in the near future at least.

It does seem to me Samsung is facing the same problem in memory sector where it is clearly falling behind SK in DRAM and YMTC in NAND.
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member

Hantian Tiancheng's 8-inch silicon carbide epitaxial wafer plant construction is completed, and equipment purchases will be completed in March​


The Xiamen Area Management Committee of the China (Fujian) Pilot Free Trade Zone announced that the 8-inch silicon carbide epitaxial wafer plant of Hantian Tiancheng Electronic Technology (Xiamen) Co., Ltd. has been successfully completed. This milestone progress marks an important step for Hantian Tiancheng in the field of silicon carbide epitaxial wafers, which is expected to inject new vitality into the development of my country's semiconductor industry.
On February 28, Hantian Tiancheng Chairman Zhao Jianhui revealed that the company's 8-inch silicon carbide epitaxial wafer plant construction has been completed. Currently, equipment procurement is in full swing and is expected to be completed in March. This series of actions demonstrates Hantian Tiancheng's efficient execution and keen insight into industry development.
As the world's largest pure epitaxial wafer manufacturer of silicon carbide semiconductors, Hantian Tiancheng successfully completed pre-IPO financing at the end of last year. The funds used to expand production capacity came from the first 10 billion AIC fund of Xiamen Free Trade International Fund Port - ICBC AIC Fund.
As a representative of the third-generation semiconductor materials, silicon carbide has excellent properties such as high breakdown electric field and high electron mobility, and has broad application prospects in new energy vehicles, 5G communications, smart grids, etc. Compared with traditional-sized wafers, 8-inch silicon carbide epitaxial wafers can manufacture more chips on the same area, effectively reduce production costs, and improve production efficiency, which is of great significance for promoting the large-scale development of the silicon carbide industry.
Hantian Tiancheng has been committed to the research and development and production of silicon carbide epitaxial wafers. With its advanced technology and rich experience, it has established a good reputation in the industry. The completion of the 8-inch silicon carbide epitaxial wafer plant will not only improve the company's production capacity and market competitiveness, but will also help ease the supply pressure in my country's high-end semiconductor materials field.
With the completion of equipment purchase, Hantian Tiancheng is expected to achieve large-scale mass production of 8-inch silicon carbide epitaxial wafers in the short term. This will not only meet the urgent demand of the domestic market for high-quality silicon carbide epitaxial wafers, but also provide strong support for the independent and controllable development of my country's semiconductor industry.

Please, Log in or Register to view URLs content!

Epiworld (their English name) has quite ambitious planning.

There are a few Chinese unicorns in SiC thus far have stuck with mostly sticking to their area of expertise. Like SiCC and TankeBlue in substrate and Epiworld in Epitaxy. And that has allowed the to just ramp up production and have significant cost advantages.
 
Top