Chinese semiconductor thread II

Sardaukar20

Captain
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A blogger's opinion about China's own EUV lithography machine.
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China's domestic extreme ultraviolet (EUV) lithography development is far from a distant dream. The newest system, now undergoing testing at Huawei's Dongguan facility, leverages laser-induced discharge plasma (LDP) technology, representing a potentially disruptive approach to EUV light generation. The system is scheduled for trial production in Q3 2025, with mass manufacturing targeted for 2026, potentially positioning China to break ASML's technical monopoly in advanced lithography. The LDP approach employed in the Chinese system generates 13.5 nm EUV radiation by vaporizing tin between electrodes and converting it to plasma via high-voltage discharge, where electron-ion collisions produce the required wavelength. This methodology offers several technical advantages over ASML's laser-produced plasma (LPP) technique, including simplified architecture, reduced footprint, improved energy efficiency, and potentially lower production costs.
ASML's EUV process (LPP) vs China's (LDP) EUV process:
View attachment 147416

If true, then China could be looking at an EUV system that is even more efficient overall, and also lower in cost than ASML's EUV machine.
 

tokenanalyst

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Domestic High Precision Structural Parts for Semiconductor Equipment, from Etching to Lithography​


Jiangsu Zihe Semiconductor Technology Co., Ltd. is a high-tech enterprise focusing on semiconductor equipment supporting. Based in Qidong, Jiangsu, the company has a modern production base covering an area of 15,000 square meters. It has introduced advanced equipment from Germany and other countries to provide customers with high-quality, high-precision and high-reliability semiconductor equipment racks, structural parts and precision parts. The company has brought together an experienced and technically competent R&D team, established a complete quality management system, and met the diversified needs of customers with one-stop solutions. The products are widely used in integrated circuits, compound semiconductors and other fields, and are highly recognized by customers. Adhering to the business philosophy of "professional, innovative, service and win-win", Jiangsu Zihe is committed to becoming a leading enterprise in the field of semiconductor equipment supporting and contributing its own strength to promoting the development of China's semiconductor industry.

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tokenanalyst

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Hisense E8Q series is officially released.​


Hisense launched the new E8Q series flagship TV with the theme of "Top Picture Quality, Film and Game Flagship", covering two versions, E8Q and E8Q Pro, bringing consumers an audio-visual feast of technology and art. The official price starts at 7499 yuan!

Hisense has always achieved remarkable results in the field of television. In 2024, Hisense TV shipments of 100-inch and above ranked first in the world, and overall shipments ranked second in the world for three consecutive years. It has ranked first in sales share in the Chinese market for 21 consecutive years, and also ranked first in sales in multiple market segments. It is the only brand in the TV industry to achieve "four firsts" in 2024, and continues to lead the high-end TV market.

The E8Q Pro released this time is a culmination of technology. It is equipped with the world's first AI picture quality chip for simultaneous control of light and color - the Xinxin AI picture quality chip H7. After three years of development and an investment of over 100 million yuan, the chip has achieved a major breakthrough in hardware computing power, with a 40% increase in CPU single-core performance, a 70% increase in scene perception computing power, and a doubling of scene adaptation computing power. Its original algorithm for simultaneous control of light and color extracts light and color information separately, performs 26-bit and 15,680-point high-precision analysis, and then maps and fits the output point by point, making the picture rich in light and dark details, with strong color contrast and a clearer sense of hierarchy. Compared with the S brand's XR picture quality chip, the Xinxin H7 not only continues its leading position, but also achieves three unique breakthroughs, including a gap-leading light and color simultaneous control algorithm, 0 delay between backlight and image, and higher-precision light and color control, with comprehensive capabilities leading in all aspects.


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tokenanalyst

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Solid State LPP EUV I think is LDP.​

Experimental Study on EUV Radiation Characteristics of 1μm Laser‐Excited Solid Sn Target Plasma​


Laboratory of Ultra-Intense Laser Science and Technology, Shanghai Institute of Optics and Precision Mechanics

Solid-state lasers are expected to replace CO 2 lasers as the driving light source for the new generation of laser plasma extreme ultraviolet (LPP-EUV) lithography light sources due to their compact size, high electro-optical conversion efficiency, and potential for high power output. An experimental platform for 1 μm solid laser-driven plasma EUV light source was established, and the EUV radiation characteristics of 1 μm laser-excited solid tin (Sn) target plasma were experimentally studied. The mechanism of the influence of laser peak power density on the EUV spectrum of Sn plasma was analyzed, and the variation of conversion efficiency (CE) and spectral purity (SP) with laser peak power density was studied. The experimental results show that SP and CE are sensitive to changes in laser peak power density. In the research and development of EUV light sources, it is necessary to finely optimize the laser peak power density acting on the Sn target. At a laser peak power density of 8.24×10 10 W/cm 2 , a CE of up to 3.42% was achieved, which is at the international advanced level. The research results provide technical support for the localization research and development of solid laser driven plasma EUV lithography light source and measurement light source, which is of great significance for my country to independently carry out the research and development of EUV lithography and its key components and technologies.​

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latenlazy

Brigadier
Solid State LPP EUV I think is LDP.​

Experimental Study on EUV Radiation Characteristics of 1μm Laser‐Excited Solid Sn Target Plasma​


Laboratory of Ultra-Intense Laser Science and Technology, Shanghai Institute of Optics and Precision Mechanics

Solid-state lasers are expected to replace CO 2 lasers as the driving light source for the new generation of laser plasma extreme ultraviolet (LPP-EUV) lithography light sources due to their compact size, high electro-optical conversion efficiency, and potential for high power output. An experimental platform for 1 μm solid laser-driven plasma EUV light source was established, and the EUV radiation characteristics of 1 μm laser-excited solid tin (Sn) target plasma were experimentally studied. The mechanism of the influence of laser peak power density on the EUV spectrum of Sn plasma was analyzed, and the variation of conversion efficiency (CE) and spectral purity (SP) with laser peak power density was studied. The experimental results show that SP and CE are sensitive to changes in laser peak power density. In the research and development of EUV light sources, it is necessary to finely optimize the laser peak power density acting on the Sn target. At a laser peak power density of 8.24×10 10 W/cm 2 , a CE of up to 3.42% was achieved, which is at the international advanced level. The research results provide technical support for the localization research and development of solid laser driven plasma EUV lithography light source and measurement light source, which is of great significance for my country to independently carry out the research and development of EUV lithography and its key components and technologies.​

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Nope. LDP uses a laser to vaporize a tin drop which then gets excited by an electrode. It’s the same excitation mechanism as DPP. The design in the paper you shared is an experimental setup for studying LPP mechanisms. The laser is driving the excitation, not simply tin vaporization. The diagram itself is not based off any instrument design. It’s a purely experimental setup meant to collect data on excitation emissions for different laser parameters.
 

tokenanalyst

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Random resistive memory-based deep extreme point learning machine for unified visual processing​

Abstract​

Visual sensors, including 3D light detection and ranging, neuromorphic dynamic vision sensor, and conventional frame cameras, are increasingly integrated into edge-side intelligent machines. However, their data are heterogeneous, causing complexity in system development. Moreover, conventional digital hardware is constrained by von Neumann bottleneck and the physical limit of transistor scaling. The computational demands of training ever-growing models further exacerbate these challenges. We propose a hardware-software co-designed random resistive memory-based deep extreme point learning machine. Data-wise, the multi-sensory data are unified as point set and processed universally. Software-wise, most weights are exempted from training. Hardware-wise, nanoscale resistive memory enables collocation of memory and processing, and leverages the inherent programming stochasticity for generating random weights. The co-design system is validated on 3D segmentation (ShapeNet), event recognition (DVS128 Gesture), and image classification (Fashion-MNIST) tasks, achieving accuracy comparable to conventional systems while delivering 6.78 × /21.04 × /15.79 × energy efficiency improvements and 70.12%/89.46%/85.61% training cost reductions.

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tokenanalyst

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Nope. LDP uses a laser to vaporize a tin drop which then gets excited by an electrode. It’s the same excitation mechanism as DPP. The design in the paper you shared is an experimental setup for studying LPP mechanisms. The laser is driving the excitation, not simply tin vaporization. The diagram itself is not based off any instrument design. It’s a purely experimental setup meant to collect data on excitation emissions for different laser parameters.
Interesting I was confusing it with this paper.

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