Zhongke Feichai: New products of inspection and measurement equipment continue to expand equity incentives, demonstrating confidence in long-term revenue growth
New product revenue continues to increase, and we are actively developing 2Xnm nano-pattern wafer defect detection equipment. In the front-end field, the company's revenue mainly comes from non-patterned and (micron-level) patterned wafer defect inspection equipment and three-dimensional topography measurement equipment. New growth points include photolithography overlay accuracy measurement equipment and metal/dielectric film thickness measurement. equipment, and actively develop nano-pattern wafer defect detection equipment. Among them.
1-overlay accuracy measurement equipment has been supplied in batches at mature process nodes, and has been verified by some customers in advanced process production lines;
2-multiple metal film thickness measurement equipment has been shipped in batches;
3-for the 2Xnm node, the company clearly stated The research and development of dark field nanopattern wafer defect detection equipment and critical dimension measurement equipment are progressing smoothly;
4-For the 1Xnm node, the company has continued to develop and deploy a variety of detection and measurement equipment.
The company's advanced packaging equipment lays out graphics wafer defect detection and three-dimensional topography measurement equipment, and its growth trend is improving. The most important inspection and measurement equipment used in the field of advanced packaging include pattern wafer defect inspection equipment, critical dimension measurement equipment, wafer dielectric film measurement equipment, and three-dimensional topography measurement equipment. The company's advanced packaging machines include.
1-graphic wafer defect detection equipment, which can be used for sub-micron two-dimensional and three-dimensional inspection of wafer surfaces. Customers include Changdian Advanced Technology, etc.;
2-three-dimensional topography measurement equipment, which is used for nano-level three-dimensional topography. Measurement, double/multi-layer film thickness measurement, critical dimensions and offset measurement, customers include Changdian Advanced, Changdian Shaoxing, etc. Considering that overseas HBM and other companies have recently generated demand for advanced packaging, and corresponding inspection and measurement equipment leaders such as Camtek and others have indicated strong demand, the growth trend of Zhongke Feichi's advanced packaging equipment is also expected to be positive.