Chinese semiconductor thread II

[tphuang]

Rumours of early April release?

With Gina Raimondo suffering from PTSD, Yellen is also rumoured that she will travel to China in April.

The bigger deal is mate 70. Will have the new huawei chip among other techs. I would wait for that. Likely to be the phone with most domestic components

 

[siegecrossbow]

The bigger deal is mate 70. Will have the new huawei chip among other techs. I would wait for that. Likely to be the phone with most domestic components

The key focus will be on Harmony OS ecosystem. I watched a YouTube video where an American or British techie showed that you can do fancy stuff like swiping a video from your phone directly onto a tablet or TV with Harmony OS installed and a whole host of other bells and whistles. Already 800 million devices connected as of early this year. Real challenge would be getting other Chinese companies to adapt it in their tech products.

 

[tokenanalyst]

Oh hey this looks like some work on cold welding of Au bond pads except with Cu. I remember some experiment of comparing efficacy of bonding and resultant surface energy between using Ar and O2 plasma clean for said bond pads. Surprised they even needed a citric acid clean. For UHV wafer bonding isn't all you need an in situ plasma clean step?

In the paper they say that plasma cleaning thought is good for bonding produce oxidation in the copper, citric acid helps to reduce the oxidation in the copper allowing according to the authors better bonding at ambient temperatures.

 

[latenlazy]

In the paper they say that plasma cleaning thought is good for bonding produce oxidation in the copper, citric acid helps to reduce the oxidation in the copper allowing according to the authors better bonding at ambient temperatures.

Gotta do something about those excited electrons even if its a cold ionization process!

 

[gelgoog]

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[ansy1968]

The bigger deal is mate 70. Will have the new huawei chip among other techs. I would wait for that. Likely to be the phone with most domestic components

Yup being waiting for this phone BUT sadly it will be sold here by the end 2025.

 

[SichuanHotPot]

I'm calling it right now:

There are only 2 possible outcomes for Arizona fab. Either it shuts down without producing even a single wafer as a typical 烂尾工程 or it produces exceedingly small volumes and eats subsidies constantly until they get tired of it, gets sold, and is immediately taken off the commercial market. And one of these will happen by 2030.

They can always sell to US military customers as well as US government that need these 5nm chips. But how many do they need is a huge question.

I think the volume is pretty small compare to the commercial market.

Also depending a lot on the state of the US encomny, if there is a major recession like 2009. Then it is game over for that fab.

 

[ansy1968]

They can always sell to US military customers as well as US government that need these 5nm chips. But how many do they need is a huge question.

I think the volume is pretty small compare to the commercial market.

Also depending a lot on the state of the US encomny, if there is a major recession like 2009. Then it is game over for that fab.

And they projecting it to SMIC, I mean with the successful launching of Huawei mate 60 pro and their ASCEND GPU, SMIC 7NM N+2 is fully book, what drugs are they taking, Hopium, Copium or both.

SMIC reported its financial results for 2023, and due to the industrial downturn, sales and profit declined for the reporting period. SMIC plans to navigate 2024 steadily and stably.3 hours ago

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[ansy1968]

The bigger deal is mate 70. Will have the new huawei chip among other techs. I would wait for that. Likely to be the phone with most domestic components

And they maybe using YMTC latest breakthrough.

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3 hours ago — YMTC's X3-6070 3D QLC NAND can sustain 4000 P/E cycles, according to the company.

 

[dropout003]

ACM Research Shanghai is expanding their semiconductor equipment layout in 2024.​

Shengmei Shanghai continues to optimize and refine existing equipment, and enriches product categories through extension development. In addition to cleaning equipment, AMC Shanghai is also actively expanding its product portfolio in semiconductor electroplating equipment, semiconductor copper polishing equipment, advanced packaging wet-process equipment, vertical furnace tube equipment, front-end coating and development (Track) equipment, and plasma enhanced chemistry. Expand layout in fields such as vapor deposition (PECVD) equipment.

In the field of semiconductor electroplating equipment, Shengmei Shanghai independently developed Ultra ECP map, an IC front-end copper interconnect copper plating technology targeting the 28nm technology node.

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In terms of advanced packaging wet-process equipment, AMC Shanghai currently has the most complete range of advanced packaging wet-process equipment lines in the world, such as cleaning, wet etching, glue coating, development, degumming, electroplating and polishing equipment (such as electropolishing) ), etc. have been used in many large client production lines.

In the field of vertical furnace tube equipment, the products developed by Shengmei Shanghai mainly include low-pressure chemical vapor deposition furnaces, oxidation annealing furnaces, alloy furnaces and atomic layer deposition furnaces. It is understood that in 2023, Shengmei Shanghai will further develop plasma atomic layer deposition technology based on the Ultra Fn vertical furnace equipment platform, combined with the previously launched differentiated thermal atomic layer deposition furnace technology (Ultra FnA) with independent intellectual property rights. Deposition vertical furnace Ultra FnA. This ALD furnace tube technology provides better step coverage and shortens ALD cycle times to increase equipment output.

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Shengmei Shanghai expects vertical furnace tube equipment to contribute significantly to revenue in 2024. In addition, ACM Shanghai is accelerating the verification of Track and PECVD equipment and the development of new customers. It is expected that Track equipment and PECVD equipment will begin to contribute revenue in large quantities by 2025.

In the field of front-end glue coating and development (Track) equipment, its front-end glue coating and development Ultra Lith TM Track equipment is an equipment used in the 300 mm high-output front-end integrated circuit manufacturing process. In the field of plasma enhanced chemical vapor deposition (PECVD) equipment, its Ultra Pmax TM PECVD equipment is equipped with differentiated cavity layout, gas distribution device and chuck design with independent intellectual property rights, which can provide better film uniformity and more optimized Film stress and less grainy properties.

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