Chinese semiconductor thread II

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O'Connor, specializing in memory chip testing equipment, has signed an agreement to establish its headquarters in Wuhan Optics Valley.​

O'Connor's headquarters project was signed and settled in Optics Valley. The company will develop domestically produced memory chip testing equipment to serve local integrated circuit companies. O'Connor is a well-known domestic memory chip testing company, and its production base is about to go into operation.

Founded in 2005, O'Connor initially manufactured circuit board testing machines. Since 2011, it has entered the memory testing field, developing testing machines that can replace corresponding models from leading international manufacturers and serving numerous leading memory module companies. Benefiting from the rapid development of the integrated circuit industry, the company's revenue this year is expected to reach 300 million yuan, more than doubling compared to last year.

Memory chip testing, simply put, is like giving storage products a factory "check-up"—comprehensive testing of the product's read/write speed, reliability, lifespan, etc., and those that fail to meet the standards are not allowed to leave the factory, which is equivalent to the "gatekeeper" of memory chips.

In April of this year, O'Connor started construction on a 3,000-square-meter factory in the Wuhan Chip Optoelectronics Industrial Park, dedicated to the production of memory chip testing equipment. The factory is currently undergoing intensive renovations and will be able to produce hundreds of machines simultaneously once it reaches full capacity by the end of the year.



Optics Valley is one of the four major integrated circuit industry bases in China, gathering over 300 companies across the industry chain. It has formed an industrial layout driven by both silicon-based semiconductors and compound semiconductors, accumulating a comprehensive technological foundation and rich achievements in emerging industries, from chip R&D and materials to manufacturing and packaging. By 2025, the scale of Optics Valley's integrated circuit industry is expected to exceed 100 billion yuan. Currently, a special task force for integrated circuit industry development has been established, and efforts are underway to build two 100-billion-yuan-level industrial innovation blocks for compound semiconductors and memory chips, accelerating the creation of a world-class integrated circuit industry ecosystem.

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Elephant Technology, in collaboration with Zhongbo Digital Intelligence, has created the first fully domestically produced liquid-cooled workstation using a "domestic chip + liquid cooling" technology, filling a gap in the domestic market.​

On June 24, 2026, XiangdiXian Computing Technology from Chongqing and Zhongbo Digital Intelligence from Beijing signed a strategic cooperation agreement to develop the world's first fully domestically produced liquid-cooled workstation. The partnership unites two key players: XiangdiXian, which specializes in high-performance, full-featured GPUs that combine computing power with graphics rendering capabilities, and Zhongbo Digital, a leader in next-generation liquid cooling systems capable of managing extreme heat for both CPUs and GPUs. By merging their respective technologies, the companies aim to create a benchmark product that overcomes the thermal limitations of traditional air cooling while ensuring a secure, end-to-end domestic supply chain from chip design to final system integration.

The collaboration is driven by the explosive growth in high-performance computing demands across sectors like industrial simulation, edge AI inference, digital twins, and film/animation post-production, where standard cooling methods fail to meet stability and efficiency requirements. While professional applications are booming, there has been a critical gap in the domestic market for workstations that offer both advanced graphical rendering capabilities and robust thermal management without relying on foreign components. This joint venture seeks to address this bottleneck by providing integrated solutions that deliver superior performance and long-term stability, effectively replacing imported hardware with reliable Chinese alternatives.

Beyond immediate product development, the strategic alliance aims to set a new industry standard for fully domestic high-end professional workstations and servers. By leveraging Zhongbo's full-stack cooling expertise alongside XiangdiXian's proprietary GPU technology, the partners plan to expand application scenarios further, enhance user experiences, and provide customers with top-tier domestic options tailored for complex tasks. This move represents a significant step toward the localization of critical computing infrastructure, ensuring that China can meet rigorous performance standards while maintaining technological independence in high-value industrial fields.​

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Jingce Electronics' subsidiary signed a 135 million yuan sales contract for open-field defect detection equipment.​

Jingce Electronics' subsidiary, Shanghai Jingce Semiconductor Technology Co., Ltd. (hereinafter referred to as "Shanghai Jingce"), recently signed a sales contract with a customer to sell open-field defect detection equipment, with a total contract value of RMB 135 million.

According to the announcement, the subject of the contract is open-field defect detection equipment. The contract will become effective upon being sealed or signed by both parties, and the delivery period is within three months after the order becomes effective. This contract signing is a routine business activity of the company, does not constitute a related-party transaction, nor does it constitute a major asset restructuring, and therefore does not require submission to the company's board of directors or shareholders' meeting for review.

Because some information in the contract involves trade secrets, Jingce Electronics has exempted itself from disclosing specific customer information in accordance with relevant regulations. The company stated that the customer has good credit, the ability to perform the contract, and the performance risk is controllable, and there is no affiliation between the customer and the company.

Jingce Electronics stated that if this contract is successfully fulfilled, it is expected to have a positive impact on the company's operating results. The signing of this contract is an important manifestation of the deepening cooperation between the company and the client based on their existing good working relationship. It reflects the client's high recognition of the company's semiconductor quality inspection equipment and will help expand the company's brand influence and enhance its market competitiveness.​

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This guys are still developing lithography machines

 

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The core component of semiconductor equipment, the "Endpoint Detection System A101-N1," has passed the scientific and technological achievement appraisal.​

An appraisal meeting for the scientific and technological achievement of the "Endpoint Detection System A101-N1," independently developed by Shanghai Cheyitian Technology Co., Ltd. (hereinafter referred to as Cheyitian ), was held at Shanghai Cheyitian Technology Co., Ltd., organized and hosted by the China Electronic Special Equipment Industry Association. The expert committee listened to the project's research report and economic benefit analysis report, reviewed the project's test report, technology novelty search report, user report, and other relevant technical documents, and inspected the product development and production site. The appraisal committee unanimously agreed that the product passed the scientific and technological achievement appraisal.



Shanghai Cheyitian Technology Co., Ltd. focuses on the research and development and manufacturing of optoelectronic control subsystems for semiconductor equipment. The company's team members have decades of experience in the industrialization of semiconductor products and are strategic partners of optoelectronic suppliers for leading domestic semiconductor equipment companies.

The company provides online detection components and subsystems in the fields of plasma spectroscopy analysis, high-precision temperature measurement and control, and gas and liquid concentration analysis, which are used in core processes of semiconductor equipment. Applications cover almost all processes in semiconductor chip manufacturing, including etching and resist stripping, thin film deposition and epitaxy, thermal treatment, and cleaning processes.

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Newray Materials: Certified by two top US semiconductor equipment manufacturers and supplying in bulk.​

Xinlai Materials officially announced that it has successfully passed certification from two leading US semiconductor equipment manufacturers and has been promoted to a Tier 1 supplier for their special processes. As the company's first domestic enterprise to achieve this dual certification, mass production of its products has commenced with order volumes remaining strong. While specific customer names remain confidential due to confidentiality agreements, the milestone underscores Xinlai's status as an indispensable upstream provider, supplying critical ultra-high purity piping systems, valves, and vacuum chambers to wafer fabs that demand rigorous cleanliness standards for process gases and liquids.



Driven by global semiconductor capacity expansion and a robust trend toward domestic supply chain localization, the company anticipates continued high capital expenditures in mainland Chinese wafer fabrication facilities through 2026, which positions its backlog favorably for sustained growth. To capitalize on these opportunities, Xinlai has aggressively expanded its production capabilities, operating bases in Huaibei, Anhui (with a second phase launched in 2025) and Kunshan, Jiangsu, specifically tailored to serve both semiconductor and panel industries. Furthermore, the company is advancing its international strategy by establishing a subsidiary in Singapore in 2025 to enhance localized service capabilities for customers across Southeast Asia and beyond.

Financially, Xinlai Materials demonstrated significant momentum in 2025, reporting operating revenue of 3.512 billion yuan, up 18.76% year-over-year, with net profit attributable to shareholders reaching 389 million yuan, an increase of 22.34%. The semiconductor sector has emerged as the primary growth driver for the company, accounting for approximately 45% of total revenue and marking a substantial shift from its previous diverse portfolio spanning food and biopharmaceuticals. By successfully navigating the transition into becoming a key player in the high-stakes US semiconductor supply chain alongside expanding its physical footprint globally, Xinlai is well-positioned to leverage both the capacity peak and substitution trends for accelerated market expansion.
​

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Coresys SS5000 testing equipment officially delivered​

On June 24, 2026, Jiangsu Xinshi Technology Co., Ltd. officially delivered its SS-5000 series Surface Scan equipment. This machine is specifically designed for patternless wafer surface defect inspection and meets the rigorous requirements for 14nm advanced semiconductor processes.



The SS-5000 unit was the fourth equipment successfully delivered by Xinshi in the first half of this year, solidifying its status as a reliable supplier. This delivery marks a crucial transition for the company from a phase of "steady ramp-up" to "continuous volume expansion," demonstrating mature mass production capabilities. The success highlights China's rapid progress in domestic front-end mass inspection equipment, accelerating the shift away from reliance on foreign technology.

Established less than three years ago (starting intensive shipments early 2025), Xinshi has gone from prototype development to nearly ten successful device deliveries by June 2026 in just over two years. The SS-5000 represents a second independently developed, mass-produced piece of equipment that successfully meets advanced process nodes, proving the company's technical accumulation and "down-to-earth" work style.

Looking ahead, Xinshi Technology aims to:​

1. Advance Process Nodes: Refine accuracy for 7nm and below processes.​
2. Expand Product Portfolio: Cover diverse applications including wafer foundries, integrated circuits (ICs), RF devices, and silicon carbide materials.​
3. Regional Impact: Leverage Wuxi's semiconductor cluster ecosystem to strengthen the domestic industry through policy support and robust market demand.​

In summary, this delivery signifies a major victory for Xinshi Technology, validating its ability to deliver high-end inspection tools at scale while setting the stage for deeper penetration into advanced nodes and broader semiconductor applications in 2026.

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Time-of-flight secondary ion mass spectrometry and X-ray photoelectron spectroscopy investigation of B4C barrier thickness effects at the Mo-on-Si interface in Mo/Si multilayers.​

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Abstract​

Atomic-scale boron carbide (B4C) interlayers ranging from 0–0.8 nm were introduced at the molybdenum-on-silicon (Mo-on-Si) interface of 30-period Mo/Si extreme ultraviolet (EUV) multilayers to investigate the influence of B4C barrier thickness on interfacial chemistry and optical performance. Time-of-flight secondary ion mass spectrometry (TOF-SIMS) provides fragment-level evidence of thickness-dependent evolution of interfacial fragment species: insertion of B4C lowers the intensities of MoSi- and MoSi2-, whereas signals from B2-/BC-, SiB-/SiC-, MoB-/MoC-, as well as MoB2-/MoBC- and SiB2-/SiBC- fragments rise gradually. X-ray photoelectron spectroscopy (XPS) peak fitting further confirms a reduced fraction of Mo-Si component and growing proportions of Mo-B and Mo-C related components. Combined TOF-SIMS and XPS analyses demonstrate that ultrathin B4C reshapes the local chemical environment at the Mo-on-Si interface instead of functioning only as a passive spacer. Structural characterizations confirm suppressed interfacial interdiffusion broadening and altered crystallization of Mo upon B4C insertion. The multilayer with a 0.4 nm-thick B4C barrier exhibits the highest EUV peak reflectivity of 61.8%, exceeding the B4C-free counterpart by 2.7 percentage points. Further optimization of deposition parameters elevates its peak reflectivity to 63.2%.​

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