Chinese semiconductor thread II

[tokenanalyst]

Wingtech Chairman Yang Mu: Nexperia China has achieved a closed-loop domestic production system!​

Following months of control disputes with Dutch authorities that resulted in Wingtech Technology losing overseas Nexperia assets, recording an 8.9 billion RMB investment loss, and triggering stock delisting warnings, Chairman Yang Mu announced at the 2026 Jiwei Conference that Nexperia China has successfully established an independent operating system. By restructuring its supply chain through localized upstream partnerships, expanded domestic packaging capabilities, and diversified sourcing, the Chinese division has built a closed-loop production cycle for MOSFETs and logic ICs, with bipolar transistors expected to complete localization by late 2026. This strategic pivot from passive crisis management to proactive reconstruction has fully decoupled Nexperia China’s operations from its Dutch counterpart, granting domestic teams complete decision-making authority and enabling rapid alignment with both local manufacturing needs and global market dynamics.

Despite the severe financial and legal fallout including a sharp revenue decline in 2025–early 2026, audit complications stemming from Dutch interference, and an ongoing 8 billion RMB lawsuit filed under China’s Anti-Foreign Sanctions Law Wingtech has stabilized through its China-based operations, which shipped over 11 billion chips by late 2025 and is projected to show improved profitability starting in Q2 2026. Yang Mu emphasized that the company remains committed to constructive dialogue while firmly refuting claims of communication avoidance, positioning its localized semiconductor ecosystem as a resilient foundation for long-term growth. Looking ahead, leadership highlighted surging demand for power and protection devices driven by AI infrastructure, smart vehicles, and robotics, a positive outlook already reflected in Wingtech’s recent stock rebound and renewed investor confidence in its domestic supply chain strategy.

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The Europeans politicians are weird. China Wingtech did their best to keep the main production of Nexperia in the Netherlands to meet European and China EV demand even if moving it to China probably was Cheaper.

They still got accused and pressure by the stooges. They cried wolf too many times now the wolf has come. Wingtech is moving their production to China, not only to meet domestic demand but also global demand in other countries. Dutch Nexperia ended worst than before.
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[tokenanalyst]

Universal Scientific Industrial (USI) showcases advanced silicon carbide wafer pre-embedded packaging technology​

USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and adopted Single-Side Copper Exposed (SSC) module packaging technology to integrate ceramic substrate insulation and wire-bondless architecture within industry-standard power packages.



USI Power Module – Chip Embedded SiC Substrate

The innovative design marks a significant advancement in internally insulated power discrete devices by enabling the package itself to deliver built-in electrical insulation while simultaneously achieving low stray inductance and minimal conduction resistance. Designed to address the growing industry demand for higher efficiency, superior thermal performance, and greater power density, USI’s chip-embedded module packaging technology dramatically reduces conduction loss, lowers heat generation, and improves long-term operational reliability compared with conventional packaging approaches. By integrating a ceramic substrate, the package body provides reliable electrical insulation without the need for additional isolation structures. Meanwhile, the wire-bondless architecture enables larger chip integration within a slim package footprint, further enhancing power density and supporting more compact system designs.

“As power platforms continue evolving toward higher efficiency and greater power density, advanced packaging technologies are becoming increasingly critical to overall system performance,” said Karl Chen, Senior Director of New Product Introduction Center at USI. “By integrating SiC/GaN chip embedding, ceramic substrate insulation, and wire-bondless architecture within industry-standard power packages, USI is enabling a new generation of compact, efficient, and highly reliable power solutions – driving the future of electric mobility, AI data center, and humanoid robotic.”

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability. This breakthrough supports the automotive and industrial sectors in their transition toward higher-efficiency and next-generation electrified platforms.

Beyond power modules, USI provides one-stop design-to-mass-production services for automotive powertrain applications, including high-density 400V/800V inverter systems, intelligent battery disconnect units (iBDU), and Xin1 integrated OBC/DCDC solutions. Combining advanced engineering, PCBA, and box-build capabilities, USI delivers complete solutions from development to high-volume manufacturing.

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[tokenanalyst]

China has achieved mass production of glass hard drives! One drive can hold 25,000 high-definition movies.​

Recently, the Hubei Optics Valley Laboratory announced that the domestically produced glass hard drive, developed by Zhang Jingyu's team at Huazhong University of Science and Technology and industrialized by Wuhan Yiyao Technology, has officially achieved small-scale mass production, making China the world's first country to achieve large-scale commercialization of glass storage technology.
The glass hard drive is a circular high-purity fused silica glass disk with a diameter of 12cm and a thickness of 2mm. The maximum capacity of a single disk is 360TB, which is equivalent to 25,000 high-definition movies. Its storage density is tens of thousands of times higher than that of Blu-ray discs.



The core technology adopts femtosecond laser 5D multidimensional optical storage technology, vertically engraving approximately 400 data layers inside the glass. High-density storage is achieved through dual encoding of birefringent volume fibers and phase voxels, and the entire industry chain is 100% domestically produced.
Its advantages are ultra-long lifespan and high stability, with a theoretical data retention lifespan of over 100,000 years, far exceeding mainstream storage media on the market.
The medium is resistant to high temperatures up to 290°C, waterproof, and electromagnetic interference-resistant. It can store data for a long time without the need for electricity, eliminating the risk of aging and loss.
Meanwhile, the media cost is only 1/10 of that of traditional storage, making it suitable for archiving massive amounts of cold data.
In terms of read and write performance, the current write speed is 8-10MB/s and the read speed is 50-200MB/s. Its core attributes are WORM (Write Once) and physical immutability, making it suitable for high-security data storage.

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[tokenanalyst]

Bojie Technology: Its subsidiary, Aodewei, produces high-speed stacking machines and testing machines suitable for the production and testing of high-end MLCCs in the AI server field.​

Recently, in response to investors' concerns about its business layout and product applications, Bojie Technology issued an official response on its interactive communication platform, detailing the application scenarios and market adaptation of the relevant equipment of its subsidiaries.

According to the company, its subsidiary, Aodewei Core, has launched two main types of equipment: a high-speed stacking machine and a high-speed testing machine. These two types of equipment have clear positioning and mainly cover the entire process of MLCC product manufacturing and finished product testing. They are important supporting equipment in the MLCC industry chain.



As the AI industry continues to develop, the market demand for AI servers is steadily increasing, leading to a corresponding increase in demand for high-end components. Audrey's equipment can also meet the manufacturing and testing requirements of high-end MLCC products in the AI server field, allowing it to successfully enter this popular supply chain segment.

At the same time, Bojie Technology also issued a special risk warning, stating that the subsequent implementation and expansion of related businesses remain uncertain due to multiple factors such as market environment, customer cooperation, and industry competition. The company reminds investors to fully consider the risks, rationally view the progress of related businesses, and make investment decisions prudently.

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[tokenanalyst]

Yudian Temperature Control Technology showcased its AI-8848 series.​

Founded in 1991, Yudian Temperature Control Technology Co., Ltd. is a national-level key "Little Giant" enterprise specializing in specialized and innovative technologies, and a national high-tech enterprise. It has two major production bases in Xiamen Xiang'an and Huli Torch High-tech Industrial Parks, with approximately 60,000 square meters of self-built modern factory buildings and a planned annual production capacity of 10 million units. It is a global leader in the industrial temperature controller industry. For 35 years, the company has been deeply involved in the industrial measurement and control field, becoming a leader in this field in China. The importance of precision temperature control technology to semiconductor manufacturing is self-evident.

Yudian Temperature Control Technology has been deeply involved in the field of precision temperature control for 35 years. For industries like semiconductors, which demand extremely high reliability and precision, Yudian is currently the only domestic temperature control brand to have its products mass-produced and installed in the core equipment of leading semiconductor equipment manufacturers. With its superior product capabilities, Yudian has become the preferred choice for leading domestic semiconductor equipment companies to replace imported products, and its products have been successfully used in mass production in core front-end semiconductor equipment with extremely stringent reliability requirements.

The AI-8848 series high-precision multi-loop intelligent temperature controller, a highlight of this exhibition, is specifically designed for the extremely high reliability requirements of semiconductors and represents the culmination of years of technological breakthroughs by Yudian Temperature Control Technology. This series boasts a measurement resolution of up to 0.001℃, with selectable measurement accuracy up to 0.05%, featuring 20ms high-speed sampling and excellent anti-interference performance. Furthermore, it incorporates a semiconductor-specific APID algorithm, perfectly meeting the extremely high reliability requirements of core processes such as semiconductor etching and vapor deposition. Currently, this product is being used in batches in various front-end semiconductor equipment, successfully achieving import substitution.

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[tokenanalyst]

From equipment to consumables, from R&D to contract manufacturing, GDNano showcases a complete nanoimprinting lithography ecosystem.​

The 10th ICMI Conference held in Shanghai from May 27 to 29 highlighted a comprehensive nanoimprinting ecosystem, with Suzhou Opto-Micro-Nano Technology Co., Ltd. as a central exhibitor. Founded in 2011, the company has established itself as a leading Chinese provider of nanoimprint equipment and integrated solutions. In August 2016, it introduced China's first fully automated mass-production nanoimprint system, quickly achieving near-total market share in the LED-PSS sector. To date, the company has shipped over 100 units, enabling more than 50 million wafers for clients, while expanding into optical devices, augmented reality, displays, and biochips.

At the exhibition, Opto-Micro-Nano displayed several advanced manufacturing systems. Its fully automated roller nanoimprint lithography equipment supports 8-inch and 12-inch substrates, delivering 10nm precision, a 10:1 aspect ratio, ±1μm alignment accuracy, and a throughput of 30 wafers per hour in a Class 10 cleanroom environment. The company also presented automated micro-nano panelization equipment capable of handling various die shapes with ±1μm positional accuracy, sub-micron adhesive thickness, and one-hour cycle times for 8-inch substrates. Additional showcased tools included high-precision alignment systems and UV soft mold nanoimprint machines designed to scale seamlessly from research development to high-volume production.



Beyond equipment, Opto-Micro-Nano offers a complete supply chain ecosystem, including critical consumables such as imprint templates, etching adhesives, and optical adhesives. The company operates a Class 100 R&D laboratory in Suzhou Industrial Park for customer process support and maintains a Class 100 manufacturing facility in Changshu that handles master template fabrication and contract production services. This end-to-end capability positions the company as a unified solution provider bridging materials, equipment, design, and mass manufacturing for the semiconductor and advanced optics industries.

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[tphuang]

https://twitter.com/i/web/status/2060815592073097460

the level of engineering excellence across Huawei to get Kunpeng-960 into production would be quite impressive. It uses 3 layers with top 2 having the PCU cores and lower layer having I/O + cache. the top 2 would be designed with circuit folding from day 1.

As such, Huawei needs to design its own new ARM core. It cannot use an existing ARM core to do this.

 

[european_guy]

China has achieved mass production of glass hard drives! One drive can hold 25,000 high-definition movies.​

Recently, the Hubei Optics Valley Laboratory announced that the domestically produced glass hard drive, developed by Zhang Jingyu's team at Huazhong University of Science and Technology and industrialized by Wuhan Yiyao Technology, has officially achieved small-scale mass production, making China the world's first country to achieve large-scale commercialization of glass storage technology.
The glass hard drive is a circular high-purity fused silica glass disk with a diameter of 12cm and a thickness of 2mm. The maximum capacity of a single disk is 360TB, which is equivalent to 25,000 high-definition movies. Its storage density is tens of thousands of times higher than that of Blu-ray discs.

View attachment 175798

The core technology adopts femtosecond laser 5D multidimensional optical storage technology, vertically engraving approximately 400 data layers inside the glass. High-density storage is achieved through dual encoding of birefringent volume fibers and phase voxels, and the entire industry chain is 100% domestically produced.
Its advantages are ultra-long lifespan and high stability, with a theoretical data retention lifespan of over 100,000 years, far exceeding mainstream storage media on the market.
The medium is resistant to high temperatures up to 290°C, waterproof, and electromagnetic interference-resistant. It can store data for a long time without the need for electricity, eliminating the risk of aging and loss.
Meanwhile, the media cost is only 1/10 of that of traditional storage, making it suitable for archiving massive amounts of cold data.
In terms of read and write performance, the current write speed is 8-10MB/s and the read speed is 50-200MB/s. Its core attributes are WORM (Write Once) and physical immutability, making it suitable for high-security data storage.

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very interesting technology, first time I hear about 360TB optical disc...but write speed has to improve of some order of magnitude....10Mb/s it means that to fill the disc it takes more than 1 year , running h24.

 

[tokenanalyst]

 

[tokenanalyst]