Chinese semiconductor thread II
- Thread starter vincent
- Start date
How you know?
This is my speculation.
-I think the frontend lithography division of SMEE was acquired by SiCarrier and Huawei, therefore SMEE, now AMIES, is going to dedicate in the manufacturing of Packaging-FPD-Power litho tools and metrology tools. SiCarrier/Huawei are going to be the main sellers of Immersion and EUV lithography tools in China.
-I think Naura could enter the lithography market with I-Line, KrF tools first and even dry ArF tools later. Could be one of the reasons for acquiring KingSemi.
-There is a probability for ACM could also enter the lithography market with I-Line and KrF tools to complement their coating and developing tools.
-I think different from ASML could be that China lithography sub-systems manufacturers are not bound to a single company. U-Precision could sell the wafer worktable stages to many companies.
-I think the frontend lithography division of SMEE was acquired by SiCarrier and Huawei, therefore SMEE, now AMIES, is going to dedicate in the manufacturing of Packaging-FPD-Power litho tools and metrology tools. SiCarrier/Huawei are going to be the main sellers of Immersion and EUV lithography tools in China.
-I think Naura could enter the lithography market with I-Line, KrF tools first and even dry ArF tools later. Could be one of the reasons for acquiring KingSemi.
-There is a probability for ACM could also enter the lithography market with I-Line and KrF tools to complement their coating and developing tools.
-I think different from ASML could be that China lithography sub-systems manufacturers are not bound to a single company. U-Precision could sell the wafer worktable stages to many companies.
I was just highlighting how Huawei specific the sourcing seems to be.
can Shanghai government let SMEE to give up its golden goose to Some other province.
this newly delivered DUVi scanner could be JV between SMEE and Huawei.. so we might see two different companies competing in DUV category.. and we all know that SMIC has been testing SMEE scanners for a while now.
don't forget, CETC too has working dry lithography machine.
The R&D and Manufacturing will still be in Shanghai but with SiCarrier/Huawei management
They have been testing/using these scanners for a while. Improving them.
CETC too but even if they have commercial companies they main selling of their products is the government, security, space and the military electronics.
Jingzhida won a semiconductor test equipment procurement contract with a total amount of 323 million yuan
Shenzhen Jingzhida Technology Co., Ltd. (stock code: 688627) announced on September 16 that its subsidiary, Hefei Jingzhida Integrated Circuit Technology Co., Ltd. ("Hefei Integrated Circuit"), has signed a contract with a customer for semiconductor test equipment. The total contract value is RMB 323 million (excluding tax). This significant contract is expected to have a positive impact on Jingzhida's operating results for fiscal years 2025 and 2026.
The semiconductor test equipment procurement agreement signed between Hefei Integrated Circuit and a customer marks another significant development for Jingzhida in the semiconductor test equipment sector. According to the announcement, this contract is a major contract for the company's daily operations, and the company has completed the internal approval procedures for signing the contract.
The contract, for semiconductor test equipment and its associated fixtures, is valued at RMB 323 million (excluding tax). The contract takes effect on the date both parties sign and seal the contract, and the performance period is as agreed upon in the contract. The contract also specifies the procurement model and dispute resolution procedures.
China first integrated circuit operation period comprehensive insurance was launched
It was learned from the Shaanxi Insurance Association that the Shaanxi Branch of China People's Insurance Company (Group) Co., Ltd. (hereinafter referred to as "PICC Shaanxi Branch") recently launched the first comprehensive insurance business for integrated circuit operation period in the country, providing innovative financial solutions for risk protection of integrated circuit enterprise Huatian Technology (Baoji) Co., Ltd. during the operation period.
This insurance product targets the core risks inherent in the operational lifecycle of integrated circuit companies, integrating three key areas of protection: all-risk property insurance, machinery damage insurance, and business interruption insurance. It provides precise coverage for direct physical damage to plant and equipment caused by natural disasters and accidents, damage to precision equipment due to equipment defects and operational errors, and indirect loss of operating profits and maintenance expenses resulting from these losses. To date, PICC Property & Casualty Insurance's Shaanxi branch has provided a total of 174 million yuan in risk protection to the company.
According to a representative from PICC Property & Casualty Insurance's Shaanxi branch, Huatian Technology (Baoji) Co., Ltd., an integrated circuit packaging and testing company, owns precision equipment such as lithography machines and etching machines, valued at tens of millions of yuan. Damage to such equipment due to sudden failures or natural disasters is not only costly to repair but can also cause production line halts, impacting the company's order delivery and market share. This insurance product provides the company with comprehensive protection from hardware assets to operating profits, effectively mitigating the impact of technology-sensitive risks on the business.
The launch of this business is an important achievement of PICC Property and Casualty Insurance Shaanxi Branch in focusing on strategic emerging industries and actively connecting with the risk protection needs of scientific and technological enterprises. It has solved problems such as the protection of high-value assets of integrated circuit companies and helped cultivate new quality productivity.
The first integrated circuit advanced packaging core equipment manufacturing project in the Chengdu-Chongqing area has entered trial production
Recently, according to the "Neijiang Political and Economic Affairs" public account, Jingyan (Sichuan) Semiconductor Equipment Co., Ltd.'s advanced packaging bonding equipment production line was officially put into use, marking the Chengdu-Chongqing area's first integrated circuit advanced packaging core equipment manufacturing project officially entering the trial production stage.
This advanced packaging bonding equipment production line covers approximately 3,000 square meters. Phase I of the project began renovations at the end of June, and trial production began by the end of August. As the only bonding equipment manufacturer in the Chengdu-Chongqing region, the Jingyan (Sichuan) project is invested in and constructed by Jiaxing Jingyan Intelligent Equipment Technology Co., Ltd., a leading company in the Yangtze River Delta semiconductor industry.
The company's products cover four major series: high-precision optical inspection equipment, flip-chip bonding equipment, wafer-level/panel-level chip bonding equipment, and 2.5D/3D packaging equipment. To date, the company has secured orders worth 50 million yuan.
This advanced packaging bonding equipment production line covers approximately 3,000 square meters. Phase I of the project began renovations at the end of June, and trial production began by the end of August. As the only bonding equipment manufacturer in the Chengdu-Chongqing region, the Jingyan (Sichuan) project is invested in and constructed by Jiaxing Jingyan Intelligent Equipment Technology Co., Ltd., a leading company in the Yangtze River Delta semiconductor industry.
The company's products cover four major series: high-precision optical inspection equipment, flip-chip bonding equipment, wafer-level/panel-level chip bonding equipment, and 2.5D/3D packaging equipment. To date, the company has secured orders worth 50 million yuan.
China Mobile Core Releases China's First Satellite and Cellular Dual-Mode Communication Chip Based on RISC-V Architecture
During the 2025 China International Fair for Trade in Services, China Mobile Group's semiconductor and chip design company, China Mobile Core, officially launched the CM6650N, China's first dual-mode narrowband satellite and cellular IoT-NTN chip based on the RISC-V open instruction set architecture, at the Digital Trade Innovation and Development Conference held in Xiongan New Area. The launch of this chip marks a significant advancement in China's satellite communications technology.
The CM6650N chip supports 3GPP Release 17's Non-Terrestrial Network (NTN) 5G standard and boasts several notable features. First, its localization rate exceeds 90%, encompassing the entire supply chain from chip IP, EDA design tools, wafer foundry, to packaging and testing, demonstrating strong independent R&D capabilities. Second, the chip excels in power consumption, with a standby current of less than 1 microampere, making it suitable for extended use.
The CM6650N supports full-band communications, operating from 700MHz to 2.5GHz, enabling dual-mode communication between terrestrial and satellite networks, adapting to a variety of application scenarios. It also supports full-mode communication with both high- and low-orbit satellites, including regenerative payload and transparent forwarding modes.
The product's core advantages lie in its compact design, two-way voice communication capabilities, and global connectivity, driving the widespread adoption of satellite communication technology in high-value sectors such as smartwatches, smartphones, and ocean shipping. China Mobile CoreSheng also offers a complete solution by combining SIM cards, chips, and data plans to help customers implement their businesses. It also provides value-added services through its connectivity management platform to accelerate market adoption. This launch reflects China's breakthroughs in key communications chips, particularly the advancement of its independent design and manufacturing capabilities for RISC-V chips, contributing to the stabilization of the domestic chip supply chain.