Chinese semiconductor thread II

swcc

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Prof. Fei Su is a tenured professor and the Xing-Hua Endowed Chair Professor at the School of Integrated Circuits, Tsinghua University. He received the B.E. and M.S. degrees from Tsinghua University, in 1999 and 2001, respectively, and the Ph.D. degree in electrical and computer engineering from Duke University in 2006. From 2006 to 2025, he was the integrated circuit architect at Intel Corporation. In 2025, he joined the school of Integrated Circuits, Tsinghua University.

His main research interests include integrated circuit testing, DFX (Design-for-Testability, Design-for-Dependability), SLM (Silicon Lifecycle Management). He is dedicated to advancing innovations from the circuit level to the architectural level, addressing critical challenges in silicon testability, reliability, availability and serviceability (RAS), safety, security, and computing resilience. His research has been applied to numerous chip products with significant industry impact. Technical innovations have led to multiple international patents in areas such as 3D chip/chiplet testing, analog chip functional safety, and intelligent sensors.

He has been actively involved in standardization of advanced research, having contributed to the development of several IEEE standards. He served as an industry mentor for multiple academia–industry research projects under the Semiconductor Research Corporation (SRC), and received the 2021 SRC Mahboob Khan Outstanding Industry Liaison Award. He was the recipient of multiple best paper awards, including the IEEE Circuits and Systems Society Outstanding Young Author Award and the IEEE International Conference on VLSI Design Best Paper Award. He has served on program and organizing committees of leading IEEE/ACM conferences (e.g., DAC, ITC, VTS, ETS), and as Associate Editor of IEEE Design and Test.
 

Wrought

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Looks like Nvidia's latest offering is underwhelming Chinese clients.

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RTX6000D, its newest artificial intelligence chip tailored for the Chinese market, has seen only lukewarm demand with some major tech firms opting not to place orders, two people with knowledge of procurement discussions said. The RTX6000D, designed mainly for AI inference tasks, is seen as expensive for what it does, the two people said. They added that testing of samples showed its performance lags the RTX5090 - a chip banned by the U.S. for use in China but which is still readily available through grey market channels at less than half the RTX6000D's price of around 50,000 yuan ($7,000).

However, it should be noted there is more interest for their B30A in the future.

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tokenanalyst

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My guess that AMEC would be entering the top ten soon​

Among the top 10 global semiconductor equipment manufacturers in the first half of 2025, North China Huachuang ranked seventh​


According to CINNO • IC Research statistics, the top 10 global semiconductor equipment manufacturers by market size had a total revenue of more than US$64 billion in the first half of 2025, an increase of approximately 24% year-on-year.

The top 10 manufacturers list remains unchanged from 2024, with the top five rankings unchanged, demonstrating the stability of the market landscape. ASML, a Dutch company, topped the list with approximately $17 billion in revenue, followed by Applied Materials (AMAT), a US company, with approximately $13.7 billion. Lam Research (LAM), Tokyo Electron (TEL), and KLA ranked third, fourth, and fifth, respectively. The top five equipment manufacturers generated nearly $54 billion in combined semiconductor revenue, accounting for approximately 85% of the total revenue of the top 10, highlighting the dominant position of leading companies.

Among the top 10 manufacturers, Chinese semiconductor equipment manufacturer NAURA is the only Chinese company. NAURA entered the global top 10 for the first time in 2023, rising from eighth to sixth place in 2024. However, in the first half of 2025, with revenue of approximately US$2.2 billion, its ranking dropped to seventh.

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tokenanalyst

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Henan: Accelerate the development of high-end chips to strengthen AI mobile phones, personal computers, large-scale all-in-one machines, and other complete devices​

On September 15, the General Office of the Henan Provincial People's Government issued the Henan Province Action Plan for Accelerating Artificial Intelligence-Enabled New Industrialization (2025-2027). The plan calls for breakthroughs in AI terminals, accelerating the development of high-end chips, and strengthening the development of complete AI devices such as mobile phones, personal computers, and large-scale all-in-one computers.
Focusing on the needs of smart cities, smart education, smart environmental protection, smart transportation, smart medical care and other fields, we develop high-end components such as smart sensors and integrated circuits, as well as artificial intelligence audio-visual terminals, medical terminals, vehicle-mounted terminals, and industrial-grade artificial intelligence terminals. We support the integration and innovation of terminal products and large models and explore new product forms.
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tokenanalyst

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Zhonggai Semiconductor achieves 6/8-inch GaN substrate production​


Dongguan Zhongjia Semiconductor Technology Co., Ltd. recently announced a major technological breakthrough: successfully mastering the fabrication technology for 6-inch and 8-inch gallium nitride single crystal substrates (Free-Standing GaN substrates). This achievement, achieved using its independently developed ultra-large hydride vapor phase epitaxy (HVPE) equipment, not only fills the international gap in HVPE technology for 6-inch and 8-inch GaN single crystal substrates, but also marks my country's successful advancement in this field.

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Through its independently developed ultra-large HVPE equipment, Zhonggai Semiconductor overcame the common cracking and warping problems in the growth of large-size GaN single crystals in early 2024 and successfully developed a 6-inch GaN single crystal substrate. Recently, it has achieved a breakthrough in the development of 8-inch GaN single crystal substrates, and obtained complete single crystal substrates through grinding and rough and fine polishing processes. Its key performance indicators have reached the international leading level, laying the foundation for large-size GaN to enter the semiconductor process.

Performance parameters:

Substrate thickness: >450μm;
Surface roughness: Ra<0.1nm;
Dislocation density: <2E6 cm-2;
FWHM: <80 arcsec;
Material background carrier concentration: <5E16 cm-3;
Electron mobility: >800 cm2/(V·s)

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tphuang

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eet-China is a credible mainstream website.

but yeah this is not the official announcement but still a big thing, author basically wrote a detailed article with suppliers list and localization rate.
eet-china has actual news and different authors writing their own analysis. This is clearly from the latter
Another former Intel Chinese is now CEO of Hua Hong. I wonder how many competitors Intel created with their mass layoffs.
you can thank the US govt for that. With new restrictions on SMEs going into China, I can see both TSMC and Samsung doing mass layoffs.

Looks like Nvidia's latest offering is underwhelming Chinese clients.



However, it should be noted there is more interest for their B30A in the future.

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well, I don't think RTX6000d was ever expected to attract a lot of people. But I do think that B30A would find a lot of interest if offered. ByteDance, Alibaba and Tencent would all be interested.
 
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