@foofy Sir all well and good, the question still remain, who will FAB it?Ali's 3D stacking chip breakthrough
Alibaba successfully developed a new architecture chip. This chip is the world's first DRAM-based 3D bonded stacked storage and computing integrated AI chip, which can break through the performance bottleneck of the von Neumann architecture and meet the needs of artificial intelligence and other scenarios for high bandwidth, high capacity memory and extreme computing power. In certain AI scenarios, the performance of the chip is increased by more than 10 times, and the energy efficiency ratio is increased by up to 300 times.