The US really is a sore loser, even splitting off makes you not save from US far ranged lawfare.
The US really is a sore loser, even splitting off makes you not save from US far ranged lawfare.
Looks like SMEE is launching a new type lithography machine for packaging and other areas. Probably and hopefully the first in a new generation of lithography machines for China.According to the official news of Shanghai Microelectronics Equipment Group, on September 18, Shanghai Microelectronics held a new product launch conference and announced the launch of the SSB520 new-generation large-field high-resolution advanced packaging lithography machine. The new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration, with the characteristics of high resolution, high engraving accuracy and super large exposure field of view.
And it can help wafer-level advanced packaging companies realize the application of multi-chip high-density interconnect packaging technology to meet the application requirements of heterogeneous integrated ultra-large chip packaging sizes.
At the same time, it will help packaging and testing manufacturers to improve their process level, develop new processes, and jointly make more contributions to the development of China's integrated circuit industry in the field of packaging and testing.
According to the official, Shanghai Microelectronics has reached a sales agreement with a number of customers for a new generation of advanced packaging lithography machines, and the first one will be delivered within this year.
According to the official website of Shanghai Microelectronics, the new generation of packaged lithography machine product projection objective lens system is fully upgraded, which can meet the requirements of 0.8μm resolution lithography process, and the limit resolution can reach 0.6μm; by upgrading the motion, measurement and control system, The accuracy of over-engraving is improved to ≤100nm, and long-term stability can be maintained.
In addition, the exposure field of view can be provided in two configurations of 53mm×66mm (4 times the standard field of view size of the IC front lane) and 60mm×60mm, which can meet the application requirements of heterogeneous integrated ultra-large chip package size.
Public information shows that Shanghai Microelectronics Equipment Group was established in 2002 and is mainly dedicated to the research and development, production, sales and service of large-scale industrial production projection lithography machines. The company’s products can be widely used in IC manufacturing and advanced packaging, MEMS, TSV/ 3D, TFT- and other manufacturing fields.
Or they talked some gullible local officials (whether in Kaoshiung or higher up) to give them subsidies again?"To build or not to build " the question that been hounding TSMC, Chip fabrication had become a national issue with them building multiple FABS in Europe, America and Japan. Then there is a question of SMIC and China, those plan 6 FABS in Kaoshiung producing 7nm may come in question cause who are the customer? If we follow market forces Its China, Are they betting that SMIC N+2 will not be produce because of the US sanction? Or they belittling the Chinese effort in having an indigenous 7nm line by 2024? Interesting times ahead with the forecast glut coming in 2022.
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@Skywatcher Sir 6 FABS is a lot, let say 25,000 wafer per plant per month for a total of 150,000 wafers, So they're really focus on 7nm, 5nm and 3nm leaving the 28nm and 14nm to the Chinese (as China will be mass producing it next year)? Sir what I heard and read 7nm and 5nm is where the money is as TSMC processes are better than Samsung so they had a monopoly.Or they talked some gullible local officials (whether in Kaoshiung or higher up) to give them subsidies again?
It's good news. As I know smee already have machine which can packaging semiconductors for 5 nm process. TSMC and Samsung still have problem with 3nm process, think a progress for little semiconductor near to the end and need find another way to improve all so new smee's machine can help. I believe that China very quickly catch up after create own line for 28nmLooks like SMEE is launching a new type lithography machine for packaging and other areas. Probably and hopefully the first in a new generation of lithography machines for China.
@Alex_St bro I think its AMEC?It's good news. As I know smee already have machine which can packaging semiconductors for 5 nm process. TSMC and Samsung still have problem with 3nm process, think a progress for little semiconductor near to the end and need find another way to improve all so new smee's machine can help. I believe that China very quickly catch up after create own line for 28nm
This machine is for advanced packaging like Chiplets, 2.5D IC or even 3D ICs if i am not mistaken. A way to extent Moore law.It's good news. As I know smee already have machine which can packaging semiconductors for 5 nm process. TSMC and Samsung still have problem with 3nm process, think a progress for little semiconductor near to the end and need find another way to improve all so new smee's machine can help. I believe that China very quickly catch up after create own line for 28nm
No, amec - it's etching equipment machine, I was write about packaging, I m not sure, maybe this smee package machine can be use for any process@Alex_St bro I think its AMEC?
The irony is that if anyone can afford to finance those nodes, it is China. But then, they won't want China financing such nodes since it comes with thoroughly sharing the developmental know-how with China.AFAIK currently 28nm is important. By 2025 I estimate that 14nm should be the mainstream.
Also top-end chips are not the most used as there are a lot of industries which use low-tech chips. No way we reach 2nm (very small possibility), 1nm, or 0.5nm (physically impossible?) by 2025. 3nm already requires such large R&D expenditure and investment and it gets so many delays. Just some days ago we were talking about TSMC having to delay its 3nm program.
Any member here has a graph/chart showing China's demand for nodes?
Not just Huawei, but Chinese tangible tech companies in general were all so blase about developing the equipment necessary to produce the goods that they made and also most of the high end components of those goods. They were happy making profits by being cobblers of assembled parts made mostly from outside of China and they calculated that since China's domestic market was so large and that demand from it was strong, they expected that in perpetuity that the West and Americans in particular would continue to pursue the logic of profit making for their companies. Then Trump came along and showed that the desire to contain and punish China, because nationalists such as himself cannot stomach the likelihood of China being economically larger than the US, that could exceed all these other considerations and placed sanctions against China and demonstrated the power to compel American allies to also not sell high tech goods to China. Donald Trump more than any exhortation, proclamation, financial assistance, and research and development undertaking and sharing by the Chinese State, ensured that at last Chinese downstream companies producing goods purchased by final consumers, most prominent among them Huawei, finally gave an unprecedented extent of market to domestic manufacturers of components and manufacturing equipment in all high tech sectors, but most prominently in the IC chips, semiconductor, and electronics appliances manufacturing sectors, and that these companies themselves also began contributing at an unprecedented magnitude to comprehensive high tech manufacturing research and development.Not expecting the political risk and counting on suppliers from adversarial countries is unwise and naive. Investing now is a positive thing but still it is disappointing that Huawei wouldn't have been doing what it has been doing without the US sanctions.