I agree, they do play it low key. With that said, this is not as secretly guarded as 5th gen fighters, so I wouldn't expect them to suddenly pull out a J-20 equivalent (i.e. EUV lithography machine) in the next year or two. Just getting their DUV machine ready for 28 and 14nm will take a while.
My personal impression is that they set up the 02 project with two considerations:
- Have a back up plan so that in case of a complete loss of outside technology before 2025 (for whatever reason), they still have the capability to build any military electronics needed, as well as "good enough" civilian electronics to keep a modern society running
- Gradually catch up to have top-tier semiconductor manufacturing capability around 2025-2030, be able to compete with the likes of ASML/TSMC around that period.
While their plan started early, actual research funding on lithography and other fabrication technology was not that much, probably tiny if compared to what ASML and TSMC had spent. If they invested 10-20x more (roughly guessing) into this over the last 10 years, it's possible that they'd have caught up much faster.
After all, advanced semiconductor manufacturing is hard, but it's not "moon landing in the 1960s" hard.
But it's hard to say China made a mistake either. There's a limited budget to work with. When you try to accelerate research ahead of your industry base it's always less cost effective making it very hard to justify.
Another thing is that China's policy planners may not have expected Huawei to lead the market so decisively and quickly. Huawei ran well ahead of China's other players in the semiconductor sector, so when attacked it couldn't get enough "cover fire" from its peers. Yet this also means if China can keep Huawei strong, it will generate a great pulling effect for China's tech supply chain to upgrade rapidly. In that sense alone it is guaranteed that Huawei will have China's full support, not just from the government, but also from the industry and consumer base.