Have a look at page 10 of the pdf file.Could you post whatever you saw that makes you think that SMIC is giving up? Also, according to Dr. Liang, SMIC's designs all the way up to 3nm are ready, just waiting for the lithograph so that might explain why they're not investing much more at this time. They're ahead waiting for the bottleneck.
Although it may be a short term hindrance, Huawei is not a company to sit it out and wait for SMIC. Although SMIC's semiconductor designs are ahead, Huawei has invested in its own fabs are is expected to advance very rapidly once the lithographs are available.
From the press release:
Dr. Haijun Zhao and Dr. Liang Mong Song, Co-CEOs of SMIC commented:“At present, the foundry industry capacity is tight, the demand for non-FinFET processes remain strong, and our capacity for non-FinFET will continue to be fully loaded. In order to meet customer needs, the Company expects capital expenditures this year to be US$4.3 billion, in which majority is for non-FinFET capacity expansion, and remaining for FinFET, the infrastructure of the new Beijing joint-venture project, and etc. In terms of capacity expansion, we increase monthly non-FinFET capacity by 10,000 for 12-inch, and not less than 45,000 for 8-inch this year. Given the impact of being added to the Entity List, we will consider strengthening the development and deployment of our first and second generation FinFET multi-platforms and expand the reliability and competitiveness of our platforms.”