Chinese semiconductor industry

According to news from Jiwei.com, on June 7, the 2023 Kunshan City (Shenzhen) Investment Promotion Conference was held in Shenzhen, and 38 major projects with a total investment of 30.52 billion yuan were signed and landed in Kunshan.

Among them, Zhou Shizhen successfully signed 3 major projects, with a planned total investment of 1.05 billion, including Jingchuang semiconductor testing equipment project, etc.; Kunshan High-tech Zone signed 5 major projects with a total investment of 7.9 billion, including Qiutai automobile camera module New projects, Shunrong Progressive Fund projects, etc. , Zhangpu Town successfully signed 3 major projects, with a planned total investment of 1.1 billion, including Juduo Optoelectronics East China Headquarters Project.

Jingchuang semiconductor testing equipment project was established by Shenzhen Jingchuang Vision Technology Co., Ltd., planning to produce testing equipment for the semiconductor industry. The main products include high-precision die-bonding machines, LDI exposure machines, etc., and is committed to becoming a leading enterprise in the semiconductor equipment industry. The total investment of the project is expected to be 500 million yuan, and the annual output value will be 800 million yuan after it reaches production capacity.

The new project of Qiutai automobile camera module is invested and established by Qiutai Technology Group. Planning to be engaged in the R&D, production and sales of automotive camera modules, IoT vision modules and their components, AR/VR complete machine systems and their components. The total investment of the contracted project is 900 million US dollars, and the annual output value can reach 5 billion yuan after it reaches production capacity.

Shunrong Progressive Fund projects focus on digital economy, dual carbon, semiconductor and other fields. Shunrong Capital has managed more than 10 blind pool funds , cultivated more than 10 IPO companies and more than 30 IPO companies from the early stage.

Juduo Optoelectronics East China Headquarters Project is invested by Shenzhen Juduo Optoelectronics Co., Ltd. It plans to produce automotive LED packaging and automotive light modules and other new energy vehicle supporting products, making Juduo Optoelectronics a leading LED light source development and production in the automotive industry enterprise.

On June 7, the National New Energy Vehicle Technology Innovation Center (referred to as "National Innovation Center") and Beijing Qingwei Intelligent Technology Co., Ltd. (referred to as "Qingwei Intelligent") signed a cooperation agreement. The two parties will cooperate on automotive chip functional safety technical consultation, functional safety training and certification, and automotive chip reliability testing. Taking this cooperation as an opportunity, they will successively establish longer-term, In-depth cooperation to achieve complementary advantages, mutual benefit and win-win, contribute to the establishment of the automotive chip industry ecology, jointly promote the localization process of automotive chips, and help the large-scale application of automotive chips.

Wang Bo, CEO of Qingwei Intelligent , and Yuan Chengyin, general manager of Guochuang Center, signed the agreement on behalf of the two parties.
Wang Bo expressed his gratitude to the National Innovation Center for its support and attention. He said: "As a brand-new AI chip type, reconfigurable computing chips are especially suitable for large data volumes due to their high energy efficiency, low power consumption, and versatility. Therefore, based on reconfigurable computing, providing high-performance computing power support for computing scenarios such as cloud-based training and push, edge-end automatic driving, and security monitoring has always been the development strategy and product landing direction of our enterprise." Wang Wang Bo said: Guochuang Center is the first national-level new energy vehicle technology innovation center, and its car-level chip testing and certification center is the first car-level chip testing and certification center in China, which is responsible for opening up the application channel for domestic chips. important mission. This cooperation is the starting point for the two parties to work together, and it is also a new breakthrough for Tsingwei to deploy automotive-grade chips.

According to SAIC-GM-Wuling official Weibo news, a few days ago, SAIC-GM-Wuling and Dianke Chip held a signing ceremony for a strategic cooperation agreement. The two sides had an in-depth conversation on the development situation of the chip industry, the general situation of enterprise development, and the continuous promotion of future cooperation plans based on the "2+N+X" cooperation framework.
At the meeting, Shen Yang, general manager of SAIC-GM-Wuling, emphasized that localization of chips is imperative. Yao Zuoping, Secretary of the Party Committee and Deputy General Manager of SAIC-GM-Wuling, pointed out that under the premise of complying with relevant laws and regulations, laboratory verification and scene verification can be carried out simultaneously, and the results can be verified through the status of vehicle loading, directly to the use scene, and then realize the chip development cycle. The shortening of the time will help realize the early landing of cooperation results.
It is reported that the two parties will take the signing of this strategic cooperation agreement as an opportunity to carry out in-depth cooperation in the field of chip research and development based on user usage scenarios. Guided by comprehensive "2C", adhere to the road of independent innovation, and work together to help chip localization and promote The company's "125 Project" project has achieved new breakthroughs and made new contributions to the power of chips and the rejuvenation of the country through science and technology!

According to the disclosure, the company's holding subsidiary Haina Co., Ltd. (hereinafter referred to as "Party B") and the Management Committee of Zhejiang Pujiang Economic Development Zone (hereinafter referred to as "Party A"), in accordance with relevant national laws and regulations and industrial policies, based on equality, mutual benefit, Based on the principle of good faith cooperation and common development, after friendly negotiation, the "Investment Framework Agreement for Semiconductor Grade Polished Wafer Production Line Project" was signed on June 8, 2023 with regard to Haina Co., Ltd.'s investment in the construction of a semiconductor grade polished wafer production line project in Pujiang County (referred to as the "Framework Agreement").

The content of the agreement shows that within 30 days from the date of signing the agreement, Party A cooperates with Party B to register and establish a company with independent legal personality in Pujiang, with a registered capital of 150 million yuan (the specific amount is subject to the results of industrial and commercial approval, and Haina shares account for 100 million yuan. %), responsible for the implementation of the project (referred to as "Party B's project company"). The Party B project company is the only entity enjoying the preferential policies given by Party A.

The total planned investment of the project is about 2 billion yuan, and the land needs to be 200 mu. The project will be constructed in two phases. The investment in the first phase project is 1 billion yuan, and the investment will be divided into two sub-projects. Among them, Subproject 1 invests about 500 million yuan to build a semiconductor-grade polished wafer production line project with an annual output of 2.6 million 4-6-inch high-end power devices. The first phase of Subproject 2 plans to invest about 500 million yuan, which will be based on Party B’s planning and investment decisions Implement projects related to the construction of the semiconductor industry. The investment in the second phase of the project is 1 billion yuan, and it is planned to build related projects in the semiconductor industry. The second phase of the project will be launched in due course according to the situation of the first phase of the project.​