Chinese semiconductor industry

, the rapid development of the domestic semiconductor industry has released a strong market demand for equipment. Under the influence of the complex international situation and other factors, the process of localization of equipment has been empowered.

Incomplete statistics from Jiwei Network show that more than 30 equipment projects have made new progress in the first half of 2022. Among them, there were over 18 contracted projects, over 14 projects under construction, and over 2 projects entering the stage of completion and production. In terms of links, the wafer manufacturing and testing equipment projects are quite popular.



· Overview of equipment projects in the first half of 2022: Jiangsu area has dense projects, and the direction of wafer manufacturing is hot

According to statistics from Jiwei.com, the projects signed/started from January to June 2022 are mainly concentrated in the Yangtze River Delta region, accounting for over 70% of the total number of projects. Among them, most projects are in the direction of wafer manufacturing and testing equipment, accounting for nearly 70% of the total number of projects in the region.

In the Jiangsu area, equipment projects in Suzhou and Wuxi were intensively implemented and started in the first half of the year, including the first-phase investment in the Deying Ruichuang semiconductor equipment project (300 million yuan), the Changchuan Technology Semiconductor AOI equipment business headquarters project, and the advanced process of Shengfeng Electronic Semiconductor. Equipment research and development and mass production project (550 million yuan), Zhuocheng Micro Semiconductor Equipment (Kunshan) Co., Ltd. semiconductor equipment production project (300 million yuan), etc.

According to the manufacturing process, semiconductor equipment is divided into front-end wafer manufacturing equipment, packaging equipment and testing equipment, and the wafer manufacturing and testing equipment projects are more popular. According to statistics from Jiwei.com, among the equipment contracts and start-up projects from January to June, wafer manufacturing equipment accounted for 34%, followed by testing equipment accounted for 32%, and packaging equipment projects accounted for 19%.

· Overview of some projects

contract

Honghao Semiconductor Equipment Development Project

Honghao Optoelectronics invested in the construction of semiconductor precision processing plants and R&D laboratories in Nanhai District, Foshan. The project covers an area of about 50 mu, and the total planned investment is about 2 billion yuan, of which the total investment in fixed assets is 1.2 billion yuan.

Jingsheng R&D Center (Hangzhou) and Semiconductor Intelligent Equipment Manufacturing Base Project

The total investment of the project is 1.03 billion yuan, and the contract is signed in Linping District, Hangzhou, to build the Jingsheng R&D Center (Hangzhou) and the semiconductor intelligent equipment manufacturing base.

Shanghai Yanzi Thin Film Deposition Equipment Project

The project was signed with Qingdao Laixi Economic Development Zone. Shanghai Yanzi Intelligent Technology Co., Ltd. focuses on the core semiconductor process - the manufacture and production of chemical thin film deposition equipment. Its core product, VPE reactor, has been independently controllable. The Laixi project, with a total investment of 500 million yuan, will become the third semiconductor film deposition equipment company in the industry and the first in Shandong Province to connect to the production line of the chip head enterprise and realize mass production after it is put into production.

Deying Ruichuang Semiconductor Equipment Project

The project was signed with Yixing Economic and Technological Development Zone. The total investment of the first phase of Deying Ruichuang semiconductor intelligent equipment project is 300 million yuan. It will build SiC silicon carbide slicing equipment, semiconductor testing equipment, and semiconductor thin film equipment production lines.

Changchuan Technology Semiconductor AOI Equipment Business Headquarters

Changchuan Technology Semiconductor AOI equipment business headquarters project is located in Suzhou Industrial Park. It is the first independent semiconductor AOI business headquarters established by Changchuan Technology in China. It is planned that in the next five years, the number of employees in Suzhou company will reach 600, and the number of intellectual property applications will exceed 150. piece.

start

Core source microelectronics integrated circuit front-end key equipment research and development and production projects

The project is expected to have a construction period of 30 months. It will be implemented by Shanghai Xinyuan Micro Enterprise Development Co., Ltd., a wholly-owned subsidiary of the company, with a planned total investment of 640 million yuan. Photolithography process glue developing machine, immersion photolithography process glue developing machine and single-chip chemical cleaning machine and other high-end semiconductor special equipment.

Zhongsheng Semiconductor R&D Center and Industrialization Base Project

The total investment of the Zhongsheng Semiconductor R&D Center and Industrialization Base project is 540 million yuan, covering an area of 23 acres. The main investor of the project is Zhongsheng Semiconductor (Shanghai) Co., Ltd., whose business focuses on the research and development, production, sales and technical services of key MOCVD (Metal Organic Chemical Vapor Deposition) equipment and technologies for the production of second and third-generation semiconductor discrete devices.

Changchuan Technology Integrated Circuit High-end Intelligent Manufacturing Base Project

The projects that Changchuan Technology has landed in Hangzhou are mainly production capacity expansion. The project has a construction area of about 137,000 square meters. After completion, it will integrate R&D, production, office, testing, service and other functions to meet the company's high-end equipment R&D and manufacturing needs.

Shengfeng electronic semiconductor advanced process equipment research and development and mass production project

The project will be invested and constructed in two phases, and will develop semiconductor packaging and testing equipment, IC substrate manufacturing equipment, integrated circuit board printing equipment and vacuum plug hole manufacturing equipment business. Set up a research and development center and a packaging and testing center, and locate the enterprise headquarters for operation

Completion/Commissioning

The main workshop of the Shanghai Zhongwei Lingang Industrialization Base (Phase I) project is capped

The project is located in Lingang Integrated Circuit Industrial Park, Shanghai, with a total construction area of about 180,000 square meters. After 133 days, the project was successfully capped. After the project is completed, it will meet the research and development, testing and industrialization needs of integrated circuits and pan-semiconductor equipment.

Advanced Technology (Huizhou) Co., Ltd. capped the third phase of the chip packaging equipment project

The ASM project introduced in Huizhou, Guangdong was completed in mid-June, which will bring an annual production capacity of 3,000 units (sets)/year of semiconductor, LED\CMOS image sensors and other chip packaging equipment. (Proofreading / Jiang Yutong)

To achieve its objectives, the administration has elected to work to block China’s access to transistors that use a specific design called FinFET. The plans include blocking domestic exports of tools that are capable of printing chips with FinFET transistors, while also preventing the tool makers — such as Applied Materials, Lam Research and KLA — from servicing or supporting equipment they have already sold to various Chinese companies, according to the sources.

Click to expand...

That will basically ruin the reputation of American companies for decades to come. They will will hurt their own companies and will lead to the Sovietization of the American semiconductor industry were there is not balance between national security and the financial heath of U.S. semiconductor companies.

huemens said:

@tokenanalyst bro, looks like they are changing the definition again. Now to FinFet instead of naming node sizes. It also mentions withholding support and maintenance for equipment that have already been delivered.

The US plans to block sales of older chipmaking tech to China​

Please, Log in or Register to view URLs content!

Click to expand...

Blocking existing equipment from getting serviced is a huge violation of terms of agreement of these purchases. It's a huge disruption to have to replace machines when you have everything set up. I don't see how many Chinese chip makers can ever buy from American company if this goes through.

If lam or applied materials win any future bids in china, it would be because the Chinese chip makers are too stupid.

The revenue of the CMP polishing pad business has increased significantly, and the net profit attributable to the parent company of Dinglong H1 increased by 112.74% year-on-year​

Jiwei.com reported on August 18 that Dinglong Co., Ltd. released a semi-annual report saying that in the first half of 2022, the company achieved operating income of 1.312 billion yuan, a year-on-year increase of 19.72%; net profit attributable to the parent was 194 million yuan, a year-on-year increase of 112.74%; Deducted non-net profit of 174 million yuan, a year-on-year increase of 83.18%.



Regarding the reasons for the increase in performance, Dinglong said that the profit of the CMP polishing pad business in the new business segment has increased significantly with the increase in revenue. The overall profit of the consumables segment has increased significantly year-on-year due to the increase in revenue, the increase in product gross profit and the impact of exchange rate changes. .

In terms of CMP polishing pads, Dinglong is the only domestic supplier of CMP polishing pads in China that fully masters the core R&D and manufacturing technology of the entire polishing pad process. It has deeply penetrated the domestic mainstream wafer fab supply chain and has an obvious leading advantage. During the reporting period, the polishing pad achieved sales revenue of 236 million yuan, an increase of 132% over the same period of the previous year. During the reporting period, the market share and sales volume of mature process products among mainstream customers further increased, and it has become the No. 1 supplier of some domestic mainstream fab customers. One supplier, the product share of other downstream customers is also gradually increasing; the market expansion of overseas customers is also progressing as planned.

In terms of research and development, after focusing on polishing pads for advanced processes in the first half of this year, the company focused on the development of polishing pads with high flattening and high removal rate based on customer needs and judgment on the development trend of polishing pads in the future. There is a range of parameters for CMP polishing pads, and a brand-new DH74XXX series polishing pad has been developed to achieve the expected purpose, and samples have been sent to some customers for testing; new products of low-defect polishing pads have been developed. Model has been ordered.

In terms of CMP polishing liquid, Dinglong's product development and verification has been advanced in an all-round way, and key products have entered the order procurement stage. In terms of product introduction, a number of key products have begun to be sold at clients, among which: the company is equipped with self-produced high-purity silicon oxide abrasive oxide layers The polishing liquid product ZX5201 has obtained orders from domestic mainstream manufacturers and is gradually increasing the volume; the aluminum process polishing liquid in the 28nm node HKMG process solves the technical "stuck neck" problem of overseas manufacturers, and its parameters all meet the customer's application requirements. All aspects of the process parameter verification, and has entered the ton-level procurement stage.

In terms of new product development and verification, the company has deployed more than 20 polishing liquid products in the polysilicon process, metal copper process, metal aluminum process, barrier layer process, metal tungsten process, and dielectric layer process. Most of them enter the verification stage at the client. The progress is in line with the company's expectations. In terms of production capacity construction, the Wuhan headquarters has an annual production capacity of 5,000 tons of fully automated polishing liquid, and the Xiantao Phase II production line with an annual output of 20,000 tons of polishing liquid has been successfully constructed recently.

In terms of cleaning fluid, the company's main products have launched large-scale sales, and new products of other process cleaning fluids have been promoted for verification. During the reporting period, the copper process post-CMP cleaning solution product DZ381 officially entered the supply chain of mainstream customers. It will achieve large-scale sales this year, and will continue to continuously improve on the basis of the existing DZ381, and launch a series of products to meet the technical needs of domestic advanced processes. ; The cleaning fluid product part of other processes after polishing is verified at the client, and the feedback is good. In terms of capacity construction, the first phase of the Wuhan headquarters has a stable supply of cleaning fluid production lines with an annual capacity of 2,000 tons, and the Xiantao Phase II cleaning fluid production line with an annual output of 10,000 tons has been successfully constructed recently.

Kronos held the unveiling ceremony of Kunpeng High-end Equipment Research Institute​

On August 16th, Shenzhen Kronos Technology Co., Ltd. held the unveiling ceremony of the Kunpeng High-end Equipment Research Institute. Kronos Chairman Yang Guang and Professor Wu Fugen, Executive Vice Dean of the Graduate School of Guangdong University of Technology jointly unveiled the institute and announced Kunpeng High-end Equipment Research Institute was officially established. The unveiling ceremony was presided over by Deputy General Manager Li Zhi of Kronos, and relevant experts such as Director Liu Jianping of the Smart Energy Research Center of Guangdong University of Technology, Professor Wang Changhong from the School of Materials and Energy and other relevant experts attended the ceremony.

Kronos Chairman Yang Guang delivered a speech

In his speech, Chairman Yang Guang of Cronos said that Cronos has always been committed to integrating domestic and foreign resources to create world-class high-end precision equipment. Professor Wu Fugen of Guangdong University of Technology, as an authoritative expert in the performance and application research of new semiconductor lasers , has great influence and appeal at home and abroad. As the executive dean of Kunpeng High-end Equipment Research Institute, he believes that in Dean Wu's work Under the leadership, Cronos will achieve breakthrough achievements in the field of high-end semiconductor equipment , and accelerate the development of Kunpeng High-end Equipment Research Institute into a domestic and international first-class semiconductor precision platform technology research and development base.

Kronos Chairman Yang Guang awarded Professor Wu Fugen
Certificate of Appointment for Executive Dean of Kunpeng High-end Equipment Research Institute

At the ceremony, Chairman Yang Guang issued an appointment certificate to Professor Wu Fugen, and formally appointed Professor Wu Fugen as the executive director of the Kunpeng High-end Equipment Research Institute.

Speech by President Wu of Kunpeng High-end Equipment Research Institute

Dean Wu said in his speech: Cronos' steady development and increasingly prominent industry influence have played an important role in building the domestic semiconductor core equipment components industry structure. Kunpeng High-end Equipment Research Institute will definitely be able to jointly promote the research and development and innovation of high-end semiconductor equipment in China and contribute to the construction of the domestic semiconductor industry.

Kunpeng High-end Equipment Research Institute will continue to upgrade mainly in the fields of semiconductor precision manufacturing equipment and other technologies and products to provide technical support for future development. Cronos always insists on technology research and development as the leading factor, and strives to catch up with the international advanced level. Among them, Cronos nano-level precision platform has a repeat positioning accuracy of ±5nm. It is designed by pressure-vacuum air bearings and ultra-high-precision encoders, and can cope with 300nm wafers at most. The encoder is positioned close to the substrate surface, reducing the already minimal offset effects, the mobile module and cross guide are designed with ceramic ( Al 2 O 3 ), which is more rigid and lighter than granite or metal designs, has a low thermal expansion coefficient, and applies laser interference instrument feedback system.



Kunpeng High-end Equipment Research Institute will make good use of school-enterprise cooperation resources, relying on the disciplinary advantages of the State Key Laboratory of the School of Mechanical and Electrical Engineering, Guangdong University of Technology, to carry out applied basic research in the field of precision electronic manufacturing technology and equipment and the core technology of high-end electronic manufacturing equipment. Parts technology research and development, combining the rich industry experience of Cronos and the strong consulting team of the State Key Laboratory of the School of Mechanical and Electrical Engineering of Guangzhou University of Technology, jointly open the frontier exploration of the two parties in the field of semiconductor precision platforms.

tphuang said:

Blocking existing equipment from getting serviced is a huge violation of terms of agreement of these purchases. It's a huge disruption to have to replace machines when you have everything set up. I don't see how many Chinese chip makers can ever buy from American company if this goes through.

If lam or applied materials win any future bids in china, it would be because the Chinese chip makers are too stupid.

Click to expand...

The majority of companies in China will typically buy foreign semicon equipment, even when there are local alternatives of good quality and superior price. It was only when industrywide sanctions expanded beyond ZTE and Huawei that the smarter executives started wising up. Even now there are a considerable number who will continue buying American semicon equipment to hedge their risk. This is the level of stupid in China even today. You see this across all sectors in China, from the semiconductor industry to the obscene level of US dollar reserves and US treasuries China continues to hold.

If America forces cancellation of service agreements, next will be withholding of parts for maintenance. This will absolutely destroy American industry and badly affect all American vassal countries as well. This is how desperate the Americans have become that they will use the nuclear option to stop what is obviously unstoppable.

tokenanalyst said:

That will basically ruin the reputation of American companies for decades to come. They will will hurt their own companies and will lead to the Sovietization of the American semiconductor industry were there is not balance between national security and the financial heath of U.S. semiconductor companies.

Click to expand...

Well are there any alternatives to the FinFET equipment from US suppliers?

Pkp88 said:

Well are there any alternatives to the FinFET equipment from US suppliers?

Click to expand...

Naura and Piotech

Please, Log in or Register to view URLs content!

AMEC


KingStoneSemi

Sir does this mean they already completed the R&D on 7nm machine? and the verification and certification will be done next year? I'm saying this cause the Chinese will only boast or promote a product IF there is a certainty that it will perform and enter production.

The founding team of KST is mainly from a world-renowned ion implanter company. It has been deeply involved in the field of ion implanters for more than 30 years. It has taken the lead in developing many best-selling ion implanters when the process technology of the integrated circuit industry is updated. With the continuous shrinking of the integrated circuit chip process process, in response to the ion implantation needs of domestic and foreign customers for advanced process chip manufacturing, KST has chosen a "one step ahead" product positioning strategy, in the "10nm and below three-dimensional device structure FinFET integrated circuit ion implanter" With the support of the scientific and technological project "R&D and Industrialization", we will develop ion implanters for cutting-edge processes (based on the beyond 7-nanometer ion implantation platform), and establish corresponding research and development platforms, core key technologies and process research parameter databases and performance testing standards.

Click to expand...

​

Hawtsing

Please, Log in or Register to view URLs content!

Universal-300 T is equipped with more advanced combined cleaning technology on the basis of 300 X model, showing better cleaning effect, which can meet Oxide/SiN/STI/Poly/Cu/W CMP of logic factories below 28nm and storage factories of 1xnm and other process requirements.


Angstrom-e


Acm research shanghai



alphasemi

Please, Log in or Register to view URLs content!

The list go on.

tphuang said:

It's a huge disruption to have to replace machines when you have everything set up. I don't see how many Chinese chip makers can ever buy from American company if this goes through.

Click to expand...

Any company that trusted these fake agreements fully deserves the pain coming to them

Overbom said:

Any company that trusted these fake agreements fully deserves the pain coming to them

Click to expand...

I trust Chinese that semiconductor is the field where they will excel. I am tired of American bullying China eventhough I am not Chinese. The day China will excel 3nm fully domestically,I will have grant party, trust me guys.