ENEPIG equipment delivered to world-renowned semiconductor manufacturers
Xinmeng Semiconductor Electroless Plating Equipment (ENEPIG) completed the manufacturing and delivery to the client, which is the first electroless plating equipment delivered in 22 years.
Since the first unit was delivered in April 2021, many units have been delivered so far. The excellent performance and high-quality service have been fully recognized by customers. The Q1 order in 2022 is strong, and the order schedule has been covered to Q4 in 2022. According to We do not have complete statistical estimates, and the Chinese market of ENEPIG equipment is already at the forefront.
"With the expansion of the global epidemic, the delivery efficiency of high-end semiconductor equipment continues to decline. Based on the optimization of the operation system, Xinmeng Semiconductor strengthens the value of the global supply chain, and actively implements epidemic prevention and control work to ensure punctual and high-quality delivery!" Deputy General Manager of Xinmeng Semiconductor Ms. Xia Xiaohong.
Electroless plating equipment (ENEPIG) is used in wafer-level packaging (CSP/COPPER PILLAR), IGBT/MOSFET wafer manufacturing and other fields.
The products launched by Xinmeng Semiconductor have:
Compared with the traditional metal deposition method, chemical plating does not require a mask, does not require a responsible process, and the method is simpler and more flexible.
Applicable to different PAD materials, including: Cu/Al/AlSi/AlSiCu/Pt/Au/Ag/GaN/Ge/GaAs, etc.
Compared with traditional deposition methods, the output of electroless plating equipment is very high
. The interaction of the arm precisely controls the flow, temperature, circulation, pH and other parameters during the process.
XM, China's leading supplier of semiconductor wet process equipment,
Xinmeng Semiconductor continues to be committed to empowering customer value, providing comprehensive solutions for wet manufacturing equipment in the fields of integrated circuit manufacturing, advanced wafer level packaging manufacturing and large silicon wafer manufacturing.

