People posted bidding info of a late build fab by a Chinese IDM here. It had next to no US equipment in the list. It was all Chinese except for ASML lithography machines.
SMIC has the capabilities to produce anything if they had relevant access to necessary machine tools. They have already proven this more than once. SMIC isn't the problem. SMIC has 14nm FinFET in full production with high yields and 10nm is in production as well.
And, of course, much like with Chinese exascale supercomputing, SMIC isn't going to go around saying what are their actual yields. Even in the best of times this is typically considered corporate secret information. When you see such numbers from companies like Intel they are typically only provided a year or two after mass production rate was achieved. This information is typically only presented to limited audiences. Giving out this information basically tells your competitors what is your production capacity and production cost per wafer. They can then use this information to squeeze you out.
14nm and lower require more passes and to be efficient you need more lithography machines. You might require twice the machines or more. Currently ASML has been having delays with machine deliveries and they already burned SMIC more than once. Given the extra expense in building such production facilities it makes sense for SMIC to focus on 28nm.
If ASML's lithography machines is the only foreign equipment needed in Chinese fab,then the fab equipment localization rate in China would over 90%,which is clearly not the case.
Of course 14nm is more expensive than 28nm,advanced note always costs more than mature nodes. That does not however, sway fabless away from pursuing advanced note,because the superior performance of advanced note simply can not offset by lower costs of mature nodes.