These guys should be taking hispeed train for a while
Chinese semiconductor industry
- Thread starter Hendrik_2000
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@tphuang BUT sir who you gonna choose Hillary or Trump? both for me are political soulmate neocons and are natural born American psycho.
It might be good for the company，but not good for the country. You see the interest of companies and government do not always align. Normally，companies have no incentives to change long term suppliers for obvious reason，so avoid sanction is the best case scenario.
But for government the goal is to help domestic supply chain to grow and push for import-substitution，so government want to push Chinese companies to use domestic equipments and materials as much as possible，something which they have no incentives to do so under normal circumstances. And it is understandable，it bears big financial risk to try something new if it doesn't workout.
Just look at the stark contrast between Huawei and ZTE now. Ever since Huawei got sanctioned，it double down on R&D，invested in a whole range of semiconductor companies from equipments to materials，which is very positive for Chinese semiconductor industry. While ZTE escaped from sanction，what did it do afterward？NOTHING. ZTE is just satisfied with their current situation and didn't strive for self-reliant in case new sanction put on them which can happen anytime.
There is an old Chinese proverb "no tear until one sees the coffin" 不见棺材不落泪. Companies do not cherish the precious time they have to push for domestic-substitution for their supplies when not sanctioned，it would be better just get sanctioned now.
The Ukraine situations is a double edged sword. It's also though Taiwan that when shits happened, Taiwanese will be on their own.
Field-effect transistor, method for making the same, and electronic circuit
Application filed by Huawei Technologies Co Ltd -2021
The application provides a field effect transistor, its preparation method and electronic circuit. During preparation, a channel layer, a control gate layer, a metal gate layer, a hard mask layer and a photoresist are sequentially formed on a substrate After layering, a first photoresist mask pattern is formed, the hard mask layer is dry-etched to form a first hard mask pattern, and the first photoresist mask pattern is subjected to size shrinkage treatment to form a first hard mask pattern. Two photoresist mask patterns, the second photoresist mask pattern exposes the part of the first hard mask pattern to form a step surface, and the first hard mask pattern, the metal gate layer and the control gate layer are sequentially applied Dry etching is performed. During the process of dry etching, the step surface is transferred downward and stays on the sidewall of the control gate. The step surface can improve the leakage problem of the sidewall. A mask patterning process is used to prepare a stepped gate structure. The process complexity and industrial cost are reduced, and only dry etching is used to form the step surface, which reduces the etching damage.
Huawei is getting deep into chip making.
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