Shengmei Shanghai launched a new series of compound semiconductor equipment to strengthen the wet process product line
Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as Shengmei Shanghai) (Science and Technology Innovation Board stock code: 688082), a leader in providing wafer process solutions for semiconductor front-end and advanced wafer-level packaging (WLP) applications supplier, today launched a comprehensive line of equipment to support compound semiconductor manufacturing. The company's 150-200mm compatible system expands the front-end integrated circuit wet process series and the back-end advanced wafer level packaging wet process series products to support applications in the field of compound semiconductors, including gallium arsenide (GaAs), nitride Processes such as Gallium (GaN) and Silicon Carbide (SiC). The compound semiconductor wet process product line includes coating equipment, developing equipment, photoresist stripping equipment, wet etching equipment, cleaning equipment and metal plating equipment, and is automatically compatible with flat edge or notched wafers.
