Chinese semiconductor thread II

tokenanalyst

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Industry First – Raycon (RuiHong) releases 70dB+ high-suppression, high-power SAW filter for low-Earth orbit satellite communication​


Raycon has officially unveiled an industry-first SAW (Surface Acoustic Wave) filter designed specifically for the demanding requirements of Raycon's low-Earth orbit satellite communication systems. This new component delivers critical performance metrics including a suppression level exceeding 70dB, high power tolerance suitable for S-band applications, and ultra-low insertion loss. By meeting these stringent standards, the filter enables direct mobile phone-to-satellite connectivity without requiring additional user equipment like receiving dishes, marking a significant advancement in aerospace-grade semiconductor technology.

The development of this solution is closely tied to the strategic goals of AST SpaceMobile, which aims to revolutionize global broadband access by leveraging S-band (2-4 GHz) frequencies instead of the more common Ku/Ka bands used by competitors like Starlink. Unlike traditional base stations that rely on heavy cavity filters accounting for over 20% of their weight, AST's "base station in the sky" architecture utilizes ultra-large-scale phased array antennas to compensate for signal loss. This approach necessitates lightweight RF components to keep satellite launch costs manageable; as a single traditional filter could weigh up to 400kg on a Block 1 satellite, Raycon's new filters measure merely 20x16mm and weigh less than 0.1g, offering an unprecedented weight-to-performance ratio essential for scalability.

To achieve the necessary high-suppression and low-loss characteristics traditionally found in cavity filters but with acoustic efficiency, Raycon's R&D team spent over a year optimizing materials, electrode processes, circuit models, and electromagnetic leakage cancellation techniques. The resulting B65 TX filter features a passband of 2120-2200MHz with a suppression greater than 70dB and power tolerance for 39dBm signals, while its matching RX counterpart ensures near-end suppression requirements are met. Additionally, the company has extended this technology to the B3 band, launching high-performance filters that maintain sub-0.1g weights and superior attenuation levels, providing a complete RF front-end solution for next-generation S-band satellites.


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Ensuring operational reliability in the harsh environment of space is paramount, and Raycon's aerospace-grade devices have undergone rigorous validation protocols including thermal vacuum power testing and specialized radiation resistance assessments. The B65 TX filter specifically participated in total dose effect tests adhering to industry standards QJ10004A-2018 and GB/T 4937.6-2018, where irradiation by a cobalt source confirmed that key parameters remained stable with no adverse drift. These rigorous trials validate the device's robustness against cumulative radiation effects, ensuring consistent performance throughout the satellite's operational lifespan.

Looking at the broader landscape of low-Earth orbit satellite communications, this innovation positions Raycon ahead of major industry players like SpaceX. While competitors have recently moved toward S-band mobile connectivity—such as SpaceX's acquisition of Echostar's spectrum and its subsidiary Tune Holdings' purchase of Akoustis for acoustic filter assets—Raycon has already demonstrated a complete end-to-end solution. By solving the critical challenge of integrating high-power, low-weight filters into large phased arrays, Raycon not only supports AST SpaceMobile's Block 2 satellite deployment but also sets a new benchmark for future multi-channel architectures where minimizing mass is as crucial as maximizing data throughput.

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tokenanalyst

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Dongwei Technology: A Leading Domestic and International Manufacturer of High-End Precision Electroplating Equipment​


Kunshan Dongwei Technology Co., Ltd. was established in December 2005 with a registered capital of RMB 298,401,360. With over 20 years of experience in the field of electronic circuit electroplating, the company has long been committed to the research, design, manufacturing, and sales of specialized precision electroplating equipment. It has become a leading manufacturer of high-end precision electroplating equipment both domestically and internationally, and was listed on the Shanghai Stock Exchange's Science and Technology Innovation Board in June 2021.

In the glass-based field , the company is actively promoting the technological research and development of PVD vacuum equipment for metallization construction, and has achieved technological breakthroughs, laying a solid foundation for subsequent processes. In the core electroplating process, Dongwei Technology, relying on its profound electroplating expertise and combining it with the characteristics of glass-based TGV via filling technology, has overcome process bottlenecks and is committed to improving the quality and stability of via filling. It has now launched horizontal and vertical electroplating solutions, creating efficient, intelligent glass-based electroplating equipment that meets market demands, from structure and performance to intelligent features, contributing to the development of the industry.
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RDL Vertical Electroplating Equipment: It adopts an electroplating structure design with the anode and cathode perpendicular to the ground and the front and rear electrodes placed separately. Through precise control of electroplating parameters and an automated system, it improves the uniformity and stability of electroplating, meets the high-precision metal deposition requirements of RDL layers in chip manufacturing and advanced packaging, and ensures line quality and signal transmission performance.

Dongwei Technology's glass-based related equipment includes:
TGV through-filling electroplating equipment for board-level applications
Glass-based RDL pattern electroplating equipment
PVD coating equipment
4.5 generation (730mm*920mm) glass-based Mini/Micro-LED display panel electroplating equipment;

Dongwei Technology's TGV equipment mass production progress :
TGV-related equipment R&D to commence in 2023
PVD R&D equipment shipped in December 2024
The first TGV through-filling electroplating equipment will be mass-produced and shipped in January 2025.
The first glass-based RDL pattern electroplating equipment will be mass-produced and shipped in February 2025.
The above-mentioned equipment has been mass-produced at the client's site and has passed equipment acceptance.

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tokenanalyst

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Tiancheng Semiconductor has successfully fabricated a 14-inch silicon carbide single crystal material.​


At the start of the new year, Tiancheng Semiconductor achieved a "successful start" with its "full-speed" work. Following its breakthroughs in 12-inch wafers, it successfully developed 14-inch silicon carbide single crystal materials with an effective thickness of 30 mm, relying on its independently developed equipment.


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By 2025, Tiancheng Semiconductor had mastered both mature processes for 12-inch high-purity semi-insulator and N-type single crystal growth , and the effective thickness of its 12-inch N-type silicon carbide single crystal material had exceeded 35 mm.

The 12-inch silicon carbide technology will further enhance its competitiveness in end markets such as new energy vehicles, meeting the urgent demand from downstream markets for cost reduction and efficiency improvement in silicon carbide. Meanwhile, the demand for 12-inch silicon carbide technology is also increasingly prominent in fields such as AR glasses (waveguides) and advanced packaging (intermediate layers) for AI chips.

14-inch silicon carbide single crystal materials are mainly used in silicon carbide components, that is, equipment parts that use silicon carbide and its composite materials as the main materials.

Silicon carbide components possess characteristics such as high density, high thermal conductivity, high bending strength, and high elastic modulus. They can withstand the harsh reaction environments of strong corrosion and ultra-high temperature in manufacturing processes such as wafer epitaxy and etching, and are widely used in equipment for major semiconductor manufacturing processes such as plasma etching, epitaxial growth, rapid thermal processing, thin film deposition, oxidation/diffusion, and ion implantation.

Currently, the silicon carbide component market is almost monopolized by suppliers from South Korea, Japan, and Europe. Tiancheng Semiconductor has once again broken through its growth barrier, marking a significant breakthrough for domestic companies in the large-size silicon carbide technology field and adding a new variable to the global silicon carbide semiconductor industry landscape.​

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Phead128

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part of the reason for not needing hopper is that bytedance & alibaba & Tencent probably all have decent size Blackwell racks that they are renting in other countries.
You can't make this up. Who knew the biggest national security threat is an engineer with a few terabytes harddrive of training data in their carry-on luggage, flying between China and neutral countries. I suppose Biden's two tier accessibility system was suppose to counter this, but it's literally impossible to police this or deter this.
 

Michael90

Senior Member
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TrendForce 2025Q4 and overall 2025 revenues. Looks like SMIC is catching up to Samsung on the fab side of things.
HH is Hua Hong Semiconductor I guess?

It’s crazy how foundries revenues are exploding due to AI demand. TSMC revenue growth has been ridiculous . From $33billion to $122billion in one year? Jesus Christ….that’s crazy. Seems they have double the revenue of all other foundries combined. Crazy

Impressive to see SMIC revenue growing very fast as well.
 

henrik

Captain
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part of the reason for not needing hopper is that bytedance & alibaba & Tencent probably all have decent size Blackwell racks that they are renting in other countries.

That would be the typical US narrative, claiming that the Chinese are not capable of making AI chips themselves. The goal is to distract the general public attention from China's AI prowess.
 

tphuang

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That would be the typical US narrative, claiming that the Chinese are not capable of making AI chips themselves. The goal is to distract the general public attention from China's AI prowess.
well, it is pretty well known that AI developers in China don't like to use CANN for training. Zai does training on their main GLM models on a cluster of ~10k H100s. I can't blame Doubao team for using a much larger blackwell cluster for training their models.
 

tokenanalyst

Lieutenant General
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Luwei Optoelectronics' RMB 1.38 billion private placement has been accepted, with the funds mainly earmarked for expanding the production capacity of high-generation, high-precision photomasks.​


Shenzhen Luwei Optoelectronics Co., Ltd. has successfully secured approval from the Shanghai Stock Exchange for a private placement of up to RMB 1.38 billion on its Science and Technology Innovation Board. This capital raise marks a significant milestone for the company, which plans to deploy the majority of these funds into expanding its production capacity for high-generation, high-precision photomasks. The primary target for this investment is the "Xiamen High-Generation High-Precision Mask Production Base Project (Phase I)," a venture with a total projected investment of RMB 1.301 billion from which RMB 1.07 billion will be sourced specifically for construction and equipment.

Under this new initiative, Luwei Optoelectronics intends to establish five high-precision flat panel display mask production lines designed to manufacture photomasks up to G8.6 specifications. These advanced capabilities cover next-generation technologies such as AMOLED displays, directly addressing the evolving needs of downstream industries. By acquiring all necessary land and completing preliminary environmental assessments ahead of time, the company is well-positioned to transition quickly from preparation to mass production, aiming to alleviate current capacity constraints while optimizing its overall product structure toward higher-value items.

As a dominant domestic player since 2012, Luwei Optoelectronics holds a unique position as the only Chinese enterprise capable of mass-producing photomasks across all generations (G2.5 to G11), fully supporting various panel production lines. The upcoming project is expected to reinforce its competitive advantage within the flat panel display supply chain in eastern and southern China, providing stable localized support for key customers like BOE Technology Group. Ultimately, this expansion will play a crucial role in building an independent and controllable ecosystem for China's new display industry and supporting the high-quality development of the broader electronic information sector.

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tokenanalyst

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Xinge Microelectronics' net profit surged 80% in 2025, with new orders reaching a record high.​


In 2025, Xinge Microelectronics (688630) delivered exceptional financial results driven by explosive global demand for AI computing power and high-speed communications. The company reported operating revenue of approximately RMB 1.408 billion, a 47.61% year-on-year increase, while its net profit attributable to shareholders surged to RMB 290 million—an impressive 80.42% rise. This performance solidified the firm's status as a specialized "little giant" in domestic direct-write lithography equipment, showcasing its core strength through rapid revenue and profitability growth amidst an accelerating industry upgrade cycle.

To meet unprecedented market demand, Xinge Microelectronics operated at full capacity throughout the year, with production facilities running at "overload" levels since early March 2025. New orders reached a record high for the fiscal year, with shipments alone showing remarkable acceleration, including over 100 units delivered in March and nearly a 30% month-on-month increase in April. Recognizing this surge, the company successfully ramped up its Phase II plant in the third quarter of 2025. This expansion integrated with existing facilities to create a unified R&D and production hub, laying the foundation for large-scale delivery and marking a new era of leapfrog development for the business.

Technologically, Xinge deepened its capabilities across key product lines, particularly in high-end PCB manufacturing. Its MAS series equipment now competes effectively against international leaders in complex areas like HDI and substrate-like PCBs, while its NEX series solder mask direct-write equipment gained widespread recognition for precision and efficiency. A major breakthrough occurred when the company secured a landmark cooperation in March 2025 to develop RTR (roll-to-roll) direct imaging equipment for flexible circuit boards. This technology was successfully applied to smartphone Flex PCBs by global brands, representing a critical leap forward for domestically produced high-end equipment in this core process area.

Furthermore, the company's independently developed laser direct writing platform continued to shine, specifically through its high-precision CO₂ laser drilling equipment which broke through core technological barriers featuring real-time position calibration and hole shape detection. This drilling technology has already entered the mass production verification stage with several leading customers as downstream capacity expands. With robust technical reserves, an ample order backlog, and a newly operational production base, Xinge Microelectronics is well-positioned to lead domestic high-end PCB lithography equipment onto the world stage as it navigates the ongoing AI revolution and overseas expansion of the PCB industry chain.

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