Chinese semiconductor thread II

FairAndUnbiased

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Is anyone familiar with ABF, please? Care to explain a little more...

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Chip Monopoly Under Threat: US, China Counterpunch Against Ajinomoto
Ikeh James April 17, 2024
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Why is it difficult for China's chip industry to become self-sufficient?

Why is it difficult for China’s chip industry to become self-sufficient?
For years, the semiconductor industry bowed to Ajinomoto’s near-absolute control over a crucial material – ABF (Anisotropic Conductive Film). This dominance sparked concerns about supply chain vulnerability, particularly for the US and China locked in a tech war. But the tide is turning.

Ajinomoto’s Grip Challenged: A Shift in Policy

Both the US and China have undergone a policy shift, prioritizing domestic chip manufacturing and reducing reliance on foreign suppliers like Ajinomoto.

US Rebuilds Domestic Muscle: The US CHIPS Act directly injects investment into chip companies building factories within the US. Even smaller players like Syntronics will benefit from this act, gaining access to funding and a US-based supply chain. This strengthens domestic production and lessens dependence on overseas suppliers.

China Seeks Self-Sufficiency: The US-led restrictions on access to cutting-edge chip technology have cornered China. While ABF isn’t currently restricted, China recognizes the risk of relying on a single foreign source for such a critical material. They are actively seeking domestic alternatives for ABF to mitigate the risk of future sanctions.

Beyond Policy: The Hurdles of Disruption

Shifting the ABF monopoly landscape requires more than just government intervention. Even with a superior alternative material, convincing the industry to adopt it widely is an uphill battle.

A History of Failed Attempts: “Many companies, including Japanese and American firms, have attempted to dethrone ABF,” says Venky Sundaram, a semiconductor expert. “These efforts achieved only limited success.”

Intricate Interdependence: Chip manufacturing is a complex ecosystem where components rely heavily on each other. Changing one material can necessitate adjustments throughout the entire process, making widespread adoption a slow and challenging feat.

Industry Buy-In: A Challenge James, another industry expert, highlights the difficulty of convincing established players to switch. “The industry might be hesitant to disrupt well-established processes,” he says.

The Road Ahead: Ajinomoto’s Reign, But Change Brewing

Ajinomoto’s market dominance is likely to persist for now, as challengers grapple with technical hurdles and industry inertia. However, the implications for the US and China differ:

US: By fostering domestic production, the US aims to reduce reliance on Ajinomoto and potentially emerge as a stronger competitor in the chip market.

China: China’s focus on domestic alternatives aims to lessen its dependence on Ajinomoto and mitigate the risk of future US sanctions hindering its technological advancements.

The future of the ABF market hinges on overcoming technical challenges and gaining industry acceptance for new materials. While Ajinomoto may retain its position for now, the combined efforts of the US, China, and potentially other players could pave the way for a more comp
etitive landscape in the long run.
it has nothing to do with chips.

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Anisotropic conductive film (ACF) is an adhesive interconnect system that is commonly used in
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manufacturing to make the electrical and mechanical connections from the driver electronics to the glass substrates of the
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. The material is also available in a paste form referred to as anisotropic conductive paste (ACP), and both are grouped together as anisotropic conductive adhesives (ACAs). ACAs have more recently been used to perform the
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-to-board or flex-to-flex connections used in handheld electronic devices such as mobile phones, MP3 players, or in the assembly of CMOS camera modules.
 

FairAndUnbiased

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Doesn't glass have silicon as one of its major elements?
compounds have little to do with their constituent elements. Can't teach basic chemistry here.
Right now chips are basically wires on silicon boards. Think about a motherboard or sound card. It's a bunch of wires printed onto a green board right? That green board is silicon. Chips are basically mini-versions of this with tiny nanometer wires printed on silicon and then packaged into a chip.

What the article is saying is they can print it onto glass now. This isn't too surprising as glass and silicon both do not conduct electricity much. This is why we use silicon, to keep the electricity in the wires separate. The question actually isn't can you do this, but can you do this at an atomic level required for modern chips. It's not going to be too useful if you can only etch 400nm chips in glass for example.
no this is utterly wrong. green board is FR-4 PCB material, which is brominated phenolic paper with an interposed Cu layer. chips are not mini versions of that at all.

Si is a vastly better conductor than glass (SiO2). We're talking multiple orders of magnitude difference in charge carrier density.

IDK what that article says. Its a nontechnical literal 10 second blip. who the hell can know what that is? All I know is that there is indeed a silicon on insulator process and that it is possible to use glass wafers for it. that's all.
 

ansy1968

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We are in a very interesting phase of the tech war because from 2023 onwards ,America has had to react to Huawei moves instead of the other way round.
Especially when Huawei introduced its 5nm N+3 phone this year that will really reel the Americans....lol Imagine the Chinese had eclipse the Americans while their TSMC Arizona Fab is expect to mass produce it in 2027-2028.
 

henrik

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Especially when Huawei introduced its 5nm N+3 phone this year that will really reel the Americans....lol Imagine the Chinese had eclipse the Americans while their TSMC Arizona Fab is expect to mass produce it in 2027-2028.

Which version of ARM is Huawei using right now? Can they sell their smartphones outside of China?

TSMC Arizona Fab will probably lose $billions, just like Intel's foundry business.
 

european_guy

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Here we are.....

Huawei’s Pura 70 Ultra Teardown Reveals The Kirin 9010 Is Mass Produced On SMIC’s 7nm Process, The Same One Used For The Mate 60’s Kirin 9000S​


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TechInsights revealed in its latest teardown of the Pura 70 Ultra that the chipset sticks with the same 7nm node from SMIC

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The chip also supports LPDDR5X RAM
 
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Awenumick

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Here we are.....

Huawei’s Pura 70 Ultra Teardown Reveals The Kirin 9010 Is Mass Produced On SMIC’s 7nm Process, The Same One Used For The Mate 60’s Kirin 9000S​


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Any info on whether they are using components from cxmt and ymtc or not? In mate 60 pro they didn't use them according to this article
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tokenanalyst

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The company's "Clean Valve Material Project" was officially launched​


Clean Valve Material Project" constructed by Youyan Semiconductor subsidiary Avtech Technology in Dezhou, Shandong Province was officially put into operation. Zhang Guohu, general manager of the company, Wang Yuantong, director of the Dezhou Tianqu New District Investment Promotion Center, Mamoru Komine, president of Japan IVT Co., Ltd., and others attended the opening ceremony.

Clean valve materials are key component materials in the semiconductor and photovoltaic industries. They can be widely used in high-end manufacturing industries such as integrated circuits, photovoltaic new energy, and liquid crystal displays, and have broad market prospects. This project is another key industrial project of Youyan Semiconductor in Texas. The commissioning of the project marks the transformation of Avtech Technology from pure product trading to R&D and manufacturing, which is a milestone for the future industrial upgrading and development of the project.

 The project will achieve a production capacity of 3,000-4,000 pieces/month within one year in accordance with the predetermined goals, provide users with high-quality products and services, further assist the localization process of semiconductor valve materials, create new growth points for shareholders, and contribute to the local economy. strength!

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tokenanalyst

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The demand for equipment in the domestic semiconductor industry continues to increase, and Shengmei Shanghai’s Q1 revenue increased by 49.63% year-on-year.​

Shengmei Shanghai released a quarterly report stating that in the first quarter of 2024, the company achieved operating income of 921 million yuan, a year-on-year increase of 49.63%; net profit attributable to the parent company was 80.1834 million yuan; non-net profit after deduction was 84.3262 million yuan.

Shengmei Shanghai said that the main reason for the substantial growth in revenue was benefiting from the increasing demand for equipment in the domestic semiconductor industry, sales orders continued to grow; new customer expansion, new market development and other aspects have achieved certain results; new products have been recognized by customers, and the number of orders Steady growth.

In recent years, although China's semiconductor industry has been slightly affected due to macro-environment and other reasons, China is still the world's largest semiconductor consumer market. In 2023, the external environment for the development of China's integrated circuit industry will become more severe. The new export policies introduced abroad will have a great impact on China's semiconductor equipment industry, but it will also bring unprecedented opportunities, which will continue to promote the domestic or regional semiconductor industry. development of.

Since its establishment, Shengmei Shanghai has been committed to providing leading equipment and process solutions to the global integrated circuit industry, adhering to the development strategy of differentiated international competition and original innovation, and established a relatively complete intellectual property system through independent research and development. Rich technology and process accumulation have formed internationally leading front-end semiconductor process equipment, including cleaning equipment (including single-chip, trough, single-chip trough combination, CO2 supercritical cleaning, edge and back scrubbing), semiconductor electroplating equipment , vertical furnace tube series equipment (including oxidation, diffusion, vacuum tempering, LPCVD, ALD), front-end glue coating and development Track equipment, plasma enhanced chemical vapor deposition PECVD equipment, stress-free polishing equipment/back-end advanced packaging process equipment As well as silicon material substrate manufacturing process equipment, etc.

In 2023, Shengmei Shanghai achieved operating income of 3.888 billion yuan, a year-on-year increase of 35.34%. The net profit attributable to shareholders of listed companies was 911 million yuan, a year-on-year increase of 36.21%. The net profit after excluding non-recurring gains and losses was 868 million yuan, a year-on-year increase. 25.77%.

In terms of products, semiconductor cleaning equipment achieved revenue of 2.614 billion yuan, a year-on-year increase of 25.79%, and a gross profit margin of 48.62%; other semiconductor equipment (electroplating, vertical furnace tubes, stress-free copper polishing and other equipment) revenue was 940 million yuan Yuan, a year-on-year increase of 81.57%, and the gross profit margin was 59.50%; the revenue of advanced packaging wet-process equipment was 160 million yuan, a year-on-year increase of 0.09%, and the gross profit margin was 42.14%.

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