Chinese semiconductor thread II

[JPaladin32]

https://twitter.com/i/web/status/1946942848009752904

Finally 5 nm mass production is coming?

Unlikely. It took TSMC 9 months to almost 1 year for N5 to reach 80% yield after initial trial production, using EUV. SMIC N+3 (or 5nm) was rumored to be in trial production late last year with DUV, so there is pretty much no way and no time for yield to ramp up this fast.

Actually, sorry for being pessimistic, we should be prepared for the possibility that 5nm won't make it to Mate 80 this year.

 

[tokenanalyst]

Changchuan Technology's net profit in the first half of the year was 427 million yuan, a year-on-year increase of 98.73%​

Changchuan Technology released its 2025 semi-annual performance report. The report shows that the company achieved operating income of 2.167 billion yuan in the first half of the year, a year-on-year increase of 41.80%; the net profit attributable to shareholders of listed companies reached 427 million yuan, a significant year-on-year increase of 98.73%. The company stated that there will be no profit distribution in this period, including no cash dividends, no bonus shares, and no capital increase from public accumulation funds.
As a leading supplier of integrated circuit test equipment in China, Changchuan Technology has mastered the core technology of integrated circuit test equipment through continuous R&D investment and technological innovation, and has obtained more than 1,150 patents at home and abroad. The company's products have successfully entered the supply chain system of domestic first-class integrated circuit companies such as Changdian Technology, Huatian Technology, and Tongfu Microelectronics, and have achieved import substitution of equipment such as testers and sorters. During the reporting period, the company focused on the layout of high-end products such as digital test equipment and three-temperature probe stations, further broadened its product line and actively explored the mid-to-high-end market.

In recent years, Changchuan Technology has achieved leapfrog development through a series of overseas mergers and acquisitions. After completing the acquisition of STI in 2019, the company acquired the industry-leading 2D/3D high-precision optical inspection technology (AOI) and established a stable cooperative relationship with international semiconductor giants such as Texas Instruments, Samsung, and Micron. After acquiring Malaysia's Exis in 2023, the company has achieved full product line coverage of gravity, translation and turret sorting machines, further enhancing its international market competitiveness.



Changchuan Technology said that it will continue to increase its R&D investment in key equipment such as probe stations and digital testers in the future, and is committed to breaking the technology monopoly of foreign manufacturers. At the same time, the company will give full play to the synergy with STI and Exis, continue to optimize the global sales network and service system, and provide better products and services to domestic and foreign customers.

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[tokenanalyst]

Maxsun Technology achieves batch delivery of wafer-level hybrid bonding equipment​

Recently, Maxsun Technology's self-developed fully automatic wafer-level hybrid bonding equipment was successfully delivered to a new domestic customer, which is another important cooperation reached by the company in the semiconductor field. With its high precision, high stability and completely independent core technology, the equipment has won multiple rounds of market verification, injecting new momentum into the independent control of domestic semiconductor equipment.



The wafer-level hybrid bonding equipment delivered this time is the result of Maxsun's completely independent research and development. The key technologies and core components are all localized to ensure supply chain security and process independence. The equipment can significantly optimize the efficiency of customers' production lines, reduce manufacturing costs, and help improve market competitiveness. As a key process equipment for semiconductor 3D packaging, hybrid bonding equipment directly affects chip integration and performance. Through continuous innovation, Maxsun has built a complete set of process solutions covering the entire process of wafer thinning, laser grooving, plasma cutting, hybrid bonding, etc., and simultaneously developed temporary bonding, thermal compression bonding (TCB) and other equipment to form a complete technology matrix.

It is reported that Maxsun's first fully automatic wafer-level hybrid bonding equipment has won the approval of customers with its sub-micron precision, long-term stable operation and high reliability. After the equipment is put into production, it will help customers build high-beat, low-loss intelligent production lines, significantly reduce manufacturing costs and shorten product launch cycles, giving them an advantage in the fierce market competition. Maxsun's bonding process equipment has undergone many iterations, and has continued to make breakthroughs in precision, reliability and intelligence, and has won orders from many industry customers. The batch delivery to new customers further verifies the strength of domestic equipment in the field of advanced packaging.

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[siegecrossbow]

the original source is iffy and as I said before, let's stop posting random tweets online. Why are we still doing this?

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It is getting picked up by other sources. I’d say that we exercise caution though unless there is more reliable information or circumstantial evidence like new Huawei phones using 5nm process.

 

[gelgoog]

It seems kind of dubious. In the case of 7nm we saw cryptomining chips available before the process was good enough to make smartphone SoCs.

 

[tokenanalyst]

 

[tokenanalyst]

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It is getting picked up by other sources. I’d say that we exercise caution though unless there is more reliable information or circumstantial evidence like new Huawei phones using 5nm process.

No all 5nm processes are the same, Is very probably they are still working in the density, but between 30-50% is not impossible if already have decent yields in their 7nm, which I believe the have because how are making so many smartphones and AI chips.

 

[tokenanalyst]

Exclusive: YMTC to pilot fully China-made NAND line in 2025, eyes 15% global share by 2026​

If that's true it would mean that Chinese immersion lithography tool is in production.

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NAND and memory is a good start for high end SAQP Lithography, its require high density but the structures are simple enough that allow for a better finetune of the lithography process than logic.

 

[tokenanalyst]

CirCore empowers the industry ecosystem with digital EDA and accelerates business innovation​

Sierxin's verification tools demonstrated excellent performance in multiple scenarios. Not only did it demonstrate the Xiangshan graphical CPU case on site, but it also announced the application results of its latest generation prototype verification system S8-100 in the complex verification process of the Xiangshan Kunming Lake 16-core RISC-V processor + NoC interconnection system. It was awarded the honor of "Strategic Contribution Partner" at the Xiangshan Open Source Community Conference. At the same time, the Xuantie R908 high energy efficiency and high real-time processor runs smoothly on the S7-19P logic system, and the real-time demonstration effect verifies its low latency and high reliability. Andes Andes Technology's 64-bit RISC-V vector processor IP core AX45MPV efficiently runs the Linux operating system and large language model on the S8-100 logic system through the ACE framework. These practices confirm that Sierxin continues to promote the implementation of RISC-V commercial innovation with flexible and efficient digital EDA tools.

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[tphuang]

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It is getting picked up by other sources. I’d say that we exercise caution though unless there is more reliable information or circumstantial evidence like new Huawei phones using 5nm process.

No all 5nm processes are the same, Is very probably they are still working in the density, but between 30-50% is not impossible if already have decent yields in their 7nm, which I believe the have because how are making so many smartphones and AI chips.

View attachment 156558

whether 5nm process is happening and at what yield is not known, but the original poster is not a reliable source. Even if he happens to be right here, he still has been wrong plenty of times before. That is my point. If they do start fabbing "5nm process", we still will need some time to get info on the critical features/dimensions and such. Again, this poster has not been a reliable source for that either.